Abstract: A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment.

Abstract: A latch apparatus and method to facilitate leveraged insertion of a component into a component bay to an interfaced position, securing of the component in the component bay when the component interfaces with a host computer, leveraged dislodgement of the component from its interfaced position for removal of the component from the component bay, and proper positioning of the latch apparatus upon insertion of the component housing to ensure proper engagement of the latch apparatus with the component bay for leveraged insertion and removal. One latch apparatus comprises a frame adapted to be secured to a proximal end of a component housing, a handle pivotally secured to the frame, and an extendable arm slidably secured to a distal end of the handle and biased toward an extended position, wherein the distal end of the extendable arm has a distally extending latch key for engaging a slot in the component bay.

Abstract: An improved carrier comprises a tray, an EMC component, and a bezel. The EMC component comprises a top spring set and a bottom spring set. Each spring set comprises a plurality of spring biased contacts connected by a plate and a bar so that each spring set moves in unison when depressed or released. Each tray has a first flange and a second flange and each of the flanges has a cut out portion. When an improved carrier is moved out of an array enclosure, the flanges depress the top spring of the EMC component of the carrier below. When the improved carrier is moved into the array enclosure, the flanges depress the top spring set of the carrier below until the top spring set of the carrier below is released by the cut-out portions of the flanges. When released, the top spring set of the carrier below contacts the bottom spring set of the carrier above to form a continuous EMC shield.

Abstract: A hard disk drive carrier having a latch apparatus to facilitate leveraged insertion of a hard disk drive into a receiving drive bay to an interfaced position, securing of the hard disk drive carrier in the drive bay when the hard disk drive secured to the carrier interfaces with a host computer, leveraged dislodgement of the hard disk drive from its interfaced position for removal of the hard disk drive from the drive bay, and proper positioning of the latch apparatus upon insertion of the hard disk drive carrier to ensure proper engagement of the latch apparatus with the drive bay for leveraged insertion and removal.

Abstract: An improved carrier comprises a tray, an EMC component, and a bezel. The EMC component comprises a top spring set and a bottom spring set. Each spring set comprises a plurality of spring biased contacts connected by a plate and a bar so that each spring set moves in unison when depressed or released. Each tray has a first flange and a second flange and each of the flanges has a cut out portion. When an improved carrier is moved out of an array enclosure, the flanges depress the top spring of the EMC component of the carrier below. When the improved carrier is moved into the array enclosure, the flanges depress the top spring set of the carrier below until the top spring set of the carrier below is released by the cut-out portions of the flanges. When released, the top spring set of the carrier below contacts the bottom spring set of the carrier above to form a continuous EMC shield.

Abstract: Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

Abstract: A method for selectively cooling one or more heat-generating electronic components in an enclosure. Air is passed through an enclosure that houses one or more heat-generating components. Heated air is separated into at least first and second parallel airstreams within the enclosure. The first airstream is passed through a first heat exchanger in thermal contact with a first side of a thermoelectric cooling module. The second airstream is passed through a second heat exchanger in thermal contact with a second side of the thermoelectric cooling module. A voltage is applied to the thermoelectric cooling module to cool the first side and heat the second side of the thermoelectric cooling module. A temperature at a location in the enclosure in sensed and the voltage applied to the thermoelectric cooling module is varied in response to the sensed temperature.

Abstract: An apparatus comprising a disk drive assembly and a disk drive cage for selectively receiving the disk drive assembly. The disk drive assembly includes first and second side rails secured to opposing sides of a disk drive, wherein the first side rail includes a distal end having a distally-opening slot configured to receive a rigid structure, such as a bent portion of the cage, fixedly extending from the disk drive cage. The slot in the first side rail enables the disk drive assembly to distally advance to a fully installed position within the disk drive cage. Incompatible disk drive assemblies do not include such a slot and are prevented from reaching the fully installed position. Preferably the distal end of first side rail extends beyond the distal end of the disk drive.

Abstract: A latch apparatus and method to facilitate leveraged insertion of a component into a component bay to an interfaced position, securing of the component in the component bay when the component interfaces with a host computer, leveraged dislodgement of the component from its interfaced position for removal of the component from the component bay, and proper positioning of the latch apparatus upon insertion of the component housing to ensure proper engagement of the latch apparatus with the component bay for leveraged insertion and removal. One latch apparatus comprises a frame adapted to be secured to a proximal end of a component housing, a handle pivotally secured to the frame, and an extendable arm slidably secured to a distal end of the handle and biased toward an extended position, wherein the distal end of the extendable arm has a distally extending latch key for engaging a slot in the component bay.

Abstract: A hard disk drive carrier having a latch apparatus to facilitate leveraged insertion of a hard disk drive into a receiving drive bay to an interfaced position, securing of the hard disk drive carrier in the drive bay when the hard disk drive secured to the carrier interfaces with a host computer, leveraged dislodgement of the hard disk drive from its interfaced position for removal of the hard disk drive from the drive bay, and proper positioning of the latch apparatus upon insertion of the hard disk drive carrier to ensure proper engagement of the latch apparatus with the drive bay for leveraged insertion and removal.

Abstract: A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment.

Abstract: Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

Abstract: A reduced insertion force mezzanine connector is used to couple first and second circuit boards. In one embodiment a connector frame has a first end disposed against the first circuit board and defining a first wall, and an opposing second end disposed against the second circuit board and defining a second wall generally parallel with the first wall. A plurality of wafers are disposed. Each wafer has a first edge in sliding contact with the first wall and an opposing second edge in sliding contact with the second wall. A plurality of electrically conducting pathways extend along each wafer from the first edge to the second edge. A wafer guide structure defines a plurality of wafer-support aisles on the first and second walls for receiving the edges of the wafers to constrain the wafers with a fixed spacing and generally parallel alignment.

Abstract: A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

Abstract: Systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

Abstract: A system and method for installing and retaining an input/output connector without tools is presented. A user removes a module from a computer system in order to add or remove a transceiver. The module includes a housing and a front bezel, whereby a bezel latch attaches the front bezel to the housing. The user depresses the bezel latch to remove the front bezel from the housing. As a result, a retention beam is exposed on the housing that secures transceivers to a circuit board. The user unlatches the retention beam, inserts a transceiver onto a mounting area, and latches the retention beam. The retention beam applies pressure to the transceiver, which results in a coupling of the transceiver to a circuit board included in the housing. In turn, the user attaches the front bezel to the housing via the bezel latch and reinserts the module into the computer system.

Abstract: A fan assembly formed of a fan, at least one fan grill comprising a face panel and at least one side panel comprising a spring slot the fan grill coupled to the fan, and a spring coupled to the fan grill the spring comprising a spring driver end extending through the spring slot.

Abstract: An automatic recirculation airflow damper for use in electronic enclosures utilizing multiple air moving devices to cool electronic components within the enclosure. When an air moving device is removed, the damper automatically closes an orifice associated with the absent air moving device, thus preventing the loss of cooling air from the vacated orifice and the subsequent reduction in cooling capacity. In some embodiments, the damper is attached to the enclosure with hinges. In certain embodiments, the damper is configured with elastomeric material such that the interface between the orifice and the damper offers high impedance to airflow while the damper is in a closed position. The automatic recirculation airflow damper reduces electronic thermal failures and therefore increases the reliability of a system equipped with the device.

Abstract: A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.

Abstract: A blade server module comprising: a housing assembly; a printed circuit board disposed within the housing assembly and mounted in a free-floating relationship thereto; a processor mounted on the printed circuit board; heat sink assembly disposed in the housing assembly in close proximity to the processor; and, one or more compliant compression elements disposed within the housing assembly so as to be preloaded to provide a force on the printed circuit board to force the heat source into thermal engagement with the heat sink assembly. Methods and systems are disclosed for effectively dissipating heat reliably in compact packaging arrangements that are particularly adapted for computing systems including blade servers.