Abstract: A lithographic apparatus is disclosed. The lithographic apparatus comprises a substrate table configured to support a substrate; actuators configurable to move the substrate table in a plane substantially parallel to the surface of the substrate; a projection system configured to pattern the substrate with fields aligned in a scanning exposure direction; a level sensor configured to sense a height of the substrate using a plurality of measurement spots; and a controller configured to control the actuators to generate strokes of relative movement between the substrate and the level sensor for mapping the height of the substrate, said strokes being at an angle of less than 20 degrees relative to the scanning exposure direction. Also disclosed is an associated method of mapping the height of a substrate.

Abstract: An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.

Abstract: An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.

Abstract: A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which one or more patterns have been applied by a lithographic process; and combining the measured topography data with knowledge relating to intra-die topology to obtain derived topography data having a resolution greater than the resolution of the measured topography data. Also disclosed is a corresponding level sensor apparatus and lithographic apparatus having such a level sensor apparatus, and a more general method of determining variation of a physical parameter from first measurement data of variation of the physical parameter across the substrate and intra-die measurement data of higher resolution than the first measurement data and combining these.

Abstract: A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which one or more patterns have been applied by a lithographic process; and combining the measured topography data with knowledge relating to intra-die topology to obtain derived topography data having a resolution greater than the resolution of the measured topography data. Also disclosed is a corresponding level sensor apparatus and lithographic apparatus having such a level sensor apparatus, and a more general method of determining variation of a physical parameter from first measurement data of variation of the physical parameter across the substrate and intra-die measurement data of higher resolution than the first measurement data and combining these.

Abstract: A device manufacturing method in a lithographic apparatus includes determining a plurality of positions on a substrate. The plurality of positions on a measurement substrate are scanned in a first direction to determine a first substrate map of the substrate levels of the measurement substrate. The plurality of positions on the measurement substrate are scanned in a second direction to determine a second substrate map of the substrate levels of the measurement substrate. A difference map is produced that includes information of the difference in measurement substrate surface level using the first substrate map and the second substrate map.

Abstract: A lithographic apparatus includes an illumination system to condition a radiation beam; a patterning device support to support a patterning device, the patterning device capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, and a projection system to project the patterned radiation beam in a scanning exposure along a scanning direction onto a target portion of the substrate. The illumination system is configured to form in a plane of the patterning device a slit shaped image. The slit shaped image has a curved shape with a slit curvature in the scanning direction, with a length in the scanning direction and a width perpendicular to the scanning direction. The slit shaped image is configured to create a curved pattern image portion of the patterned radiation beam in an image plane of the projection system.

Abstract: A device manufacturing method in a lithographic apparatus includes determining a plurality of positions on a substrate. The plurality of positions on a measurement substrate are scanned in a first direction to determine a first substrate map of the substrate levels of the measurement substrate. The plurality of positions on the measurement substrate are scanned in a second direction to determine a second substrate map of the substrate levels of the measurement substrate. A difference map is produced that includes information of the difference in measurement substrate surface level using the first substrate map and the second substrate map.

Abstract: A method according to one embodiment of the invention includes determining a map of a second part of a substrate belonging to a group of substrates. The method includes measuring a first part of at least one substrate belonging to the group to create an average profile map or average height map and computing a map of the second part of the substrate belonging to the group, based on the average profile map or the average height map. The computed map is stored for use during a later determination of a height or tilt of a substrate from the group.

Abstract: A lithographic apparatus includes an illumination system to condition a radiation beam; a patterning device support to support a patterning device, the patterning device capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate, and a projection system to project the patterned radiation beam in a scanning exposure along a scanning direction onto a target portion of the substrate. The illumination system is configured to form in a plane of the patterning device a slit shaped image. The slit shaped image has a curved shape with a slit curvature in the scanning direction, with a length in the scanning direction and a width perpendicular to the scanning direction. The slit shaped image is configured to create a curved pattern image portion of the patterned radiation beam in an image plane of the projection system.

Abstract: A method according to one embodiment of the invention includes determining a map of a second part of a substrate belonging to a group of substrates. The method includes measuring a first part of at least one substrate belonging to the group to create an average profile map or average height map and computing a map of the second part of the substrate belonging to the group, based on the average profile map or the average height map. The computed map is stored for use during a later determination of a height or tilt of a substrate from the group.

Abstract: An assembly according to an embodiment of the invention includes a sensor for determining at least one of tilt and height of a surface of a substrate in a lithographic apparatus. The substrate is moveable along at least one path substantially parallel to the surface of the substrate with respect to the sensor. The lithographic apparatus has an exposure scanning direction and the assembly is arranged to move the substrate relative to the sensor along the at least one path and to provide measurement data about the at least one of tilt and height along the at least one path. The assembly includes a memory configured to store the measurement data for use during a later exposure of the substrate by the lithographic apparatus. The at least one path of the substrate is at least partly at an angle to the exposure scanning direction.

Abstract: An assembly according to an embodiment of the invention includes a sensor for determining at least one of tilt and height of a surface of a substrate in a lithographic apparatus. The substrate is moveable along at least one path substantially parallel to the surface of the substrate with respect to the sensor. The lithographic apparatus has an exposure scanning direction and the assembly is arranged to move the substrate relative to the sensor along the at least one path and to provide measurement data about the at least one of tilt and height along the at least one path. The assembly includes a memory configured to store the measurement data for use during a later exposure of the substrate by the lithographic apparatus. The at least one path of the substrate is at least partly at an angle to the exposure scanning direction.