Patents by Inventor Martin Köffler

Martin Köffler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8435356
    Abstract: A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: May 7, 2013
    Assignee: Lam Research AG
    Inventors: Rainer Obweger, Alexander Pfeuffer, Martin Köffler, Alexander Lippert
  • Patent number: 8261757
    Abstract: A device for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.
    Type: Grant
    Filed: June 17, 2004
    Date of Patent: September 11, 2012
    Assignee: Lam Research AG
    Inventors: Rainer Obweger, Alexander Pfeuffer, Martin Köffler, Alexander Lippert
  • Publication number: 20120167914
    Abstract: A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.
    Type: Application
    Filed: March 8, 2012
    Publication date: July 5, 2012
    Applicant: LAM RESEARCH AG
    Inventors: Rainer OBWEGER, Alexander Pfeuffer, Martin Köffler, Alexander Lippert