Patents by Inventor Martin Ka Shing Li

Martin Ka Shing Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Singulation of IC packages
    Patent number: 8809121
    Abstract: A method of dividing a two dimensional array of encapsulated integrated circuits into individual integrated circuit packages uses a first series of parallel cuts (32) extending fully through the leadframe (16) and encapsulation layer (14), and defining rows of the array. The cuts terminate before the beginning and end of the rows such that the integrity of the array is maintained by edge portions (34) at the ends of the rows. After plating contact pads (18), a second series of parallel cuts (36) is made extending fully through the leadframe (16) and encapsulation layer (14). This separates the array into columns thereby providing singulation of packages between the edge portions (34).
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: August 19, 2014
    Assignee: NXP B.V.
    Inventors: Martin Ka Shing Li, Max Leung, Pompeo Umali
  • SINGULATION OF IC PACKAGES
    Publication number: 20130302945
    Abstract: A method of dividing a two dimensional array of encapsulated integrated circuits into individual integrated circuit packages uses a first series of parallel cuts (32) extending fully through the leadframe (16) and encapsulation layer (14), and defining rows of the array. The cuts terminate before the beginning and end of the rows such that the integrity of the array is maintained by edge portions (34) at the ends of the rows. After plating contact pads (18), a second series of parallel cuts (36) is made extending fully through the leadframe (16) and encapsulation layer (14). This separates the array into columns thereby providing singulation of packages between the edge portions (34).
    Type: Application
    Filed: September 29, 2010
    Publication date: November 14, 2013
    Applicant: NXP B.V.
    Inventors: Martin Ka Shing Li, Max Leung, Pompeo Umali