Patents by Inventor Martin Klepeis

Martin Klepeis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integral mesh flat plate cooling module
    Patent number: 5825087
    Abstract: An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module.
    Type: Grant
    Filed: December 3, 1996
    Date of Patent: October 20, 1998
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, Martin Klepeis, Gaetano Paolo Messina, Raed Sherif
  • Integral mesh flat plate cooling method
    Patent number: 5770478
    Abstract: An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: June 23, 1998
    Assignee: International Business Machines Corporation
    Inventors: Sushumna Iruvanti, Martin Klepeis, Gaetano Paolo Messina, Raed Sherif