Abstract: An actuation device for a motor vehicle, in particular for specifying a braking and/or acceleration request, with a first and a second housing portion is disclosed. The first housing portion includes an actuating surface on a top surface facing away from the second housing portion, or a cover with the actuating surface is arranged on the top surface. The housing portions are connected to each other by a hinge. An axis of rotation of the hinge is arranged laterally spaced apart from the actuating surface.

Abstract: An actuation device for a motor vehicle, in particular for specifying a braking and/or acceleration request, includes a first housing portion which is slidably mounted on a second housing portion in a vertical extension of the second housing portion. The first housing portion includes an actuating surface on a top surface facing away from the second housing portion, or a cover having the actuating surface is arranged on the top surface. The first housing portion includes a bar-shaped projection on an inner side facing the second housing portion. Further, the second housing portion includes a guide receptacle for the projection for the guided, slidable mounting of the first housing portion on the second housing portion.

Abstract: A sensor arrangement for an actuation device of a motor vehicle is disclosed which has a force transfer element and which can be assigned or is assigned in particular to an actuating surface of the actuation device for transferring an actuating force applied to the actuation device, in particular on the actuating surface. The sensor arrangement further has a measuring head arranged in a printed circuit board. The measuring head has a measuring membrane. The measuring membrane has a force sensor element at one end and is assigned to the force transfer element at the other end, in particular abutting the force transfer element.

Abstract: A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module.

Abstract: A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module.

Abstract: According to an embodiment, a press-fit connector includes a first part with a first end and with a second end, and a second part with a first end and with a second end. The second end of the first part is electrically and mechanically joined to the first end of the second part. The first part is made of a first material with a first mechanical strength. The second part is made of a second material with a second mechanical strength. The first mechanical strength is greater than the second mechanical strength.