Abstract: A light-mixing rod for emitting a homogeneous light beam corresponding to a desired outline shape, said light-mixing rod extending from its first longitudinal end with an entrance face for incident light for forming the light beam along a longitudinal axis to its second longitudinal end with an exit face having the outline shape for emitting the light beam, wherein a first part of the light-mixing rod is made from a first material and a second part of the light-mixing rod with the exit face is made from a second material that is optically more diffuse. A luminous arrangement contains the light-mixing rod and an optical unit, connected downstream of the exit face in the direction of the longitudinal axis, for the light beam for imaging the exit face on a target face that is situated in a specifiable relative position (R) with respect to the exit face.

Abstract: A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.

Abstract: A device for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.

Abstract: A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.

Abstract: Disclosed is a device for wet treating a flat plate-like substrate utilizing ultrasonic energy and a method associated with the device.