Patents by Inventor Martin Koxxy
Martin Koxxy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130321018Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: May 23, 2013Publication date: December 5, 2013Applicant: CASCADE MICROTECH, INC.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 8451017Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: June 18, 2010Date of Patent: May 28, 2013Assignee: Cascade Microtech, Inc.Inventors: K. Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20100271060Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: June 18, 2010Publication date: October 28, 2010Applicant: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7761986Abstract: A method of probing an electrical device using a membrane probing system having an improved contact. A membrane probe forms a contact having a ridge with a pair of inclined surfaces defining an acute angle such that, when pressed into an electrical pad of a device to be tested, the ridge penetrates into the electrical pad, shearing away any oxide on the surface of the pad. The device may then be tested.Type: GrantFiled: November 10, 2003Date of Patent: July 27, 2010Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7681312Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: July 31, 2007Date of Patent: March 23, 2010Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7400155Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: February 3, 2004Date of Patent: July 15, 2008Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20080106290Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: January 2, 2008Publication date: May 8, 2008Inventors: Warren Harwood, Paul Tervo, Martin Koxxy
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Publication number: 20070283555Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: July 31, 2007Publication date: December 13, 2007Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20070245536Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: June 21, 2007Publication date: October 25, 2007Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 7266889Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: January 14, 2005Date of Patent: September 11, 2007Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20060284630Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.Type: ApplicationFiled: August 23, 2006Publication date: December 21, 2006Inventors: Paul Tervo, Kenneth Smith, Clarence Cowan, Mike Dauphinais, Martin Koxxy
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Publication number: 20060132157Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: December 22, 2005Publication date: June 22, 2006Inventors: Warren Harwood, Paul Tervo, Martin Koxxy
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Publication number: 20050248359Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.Type: ApplicationFiled: June 3, 2005Publication date: November 10, 2005Inventors: Paul Tervo, Kenneth Smith, Clarence Cowan, Mike Dauphinais, Martin Koxxy
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Publication number: 20050136562Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: January 14, 2005Publication date: June 23, 2005Inventors: Reed Gleason, Michael Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6860009Abstract: A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.Type: GrantFiled: March 22, 2001Date of Patent: March 1, 2005Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20050017741Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.Type: ApplicationFiled: August 25, 2004Publication date: January 27, 2005Inventors: Warren Harwood, Paul Tervo, Martin Koxxy
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Publication number: 20050007131Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.Type: ApplicationFiled: July 29, 2004Publication date: January 13, 2005Inventors: Paul Tervo, Kenneth Smith, Clarence Cowan, Mike Dauphinais, Martin Koxxy
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Patent number: 6825677Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material islocated within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: GrantFiled: March 22, 2001Date of Patent: November 30, 2004Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20040154155Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: February 3, 2004Publication date: August 12, 2004Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Publication number: 20040093716Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: November 10, 2003Publication date: May 20, 2004Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy