Abstract: A plasma generation device includes: a substrate having a first surface and a second surface; a stripline resonant ring disposed on the first surface of the substrate, and defining a discharge gap; a pair of electrode extensions connected to the stripline resonant ring at the discharge gap; a ground plane disposed on the second surface of the substrate; a gas flow element configured to flow gas between at least one of: (1) the discharge gap, and (2) the pair of electrode extensions; and a structure disposed adjacent the substrate to form an enclosure that substantially encloses at least a region including the discharge gap and the electrode extensions, the enclosure being adapted to contain a plasma.

Abstract: A plasma generation device includes: a substrate having a first surface and a second surface; a stripline resonant ring disposed on the first surface of the substrate, and defining a discharge gap; a pair of electrode extensions connected to the stripline resonant ring at the discharge gap; a ground plane disposed on the second surface of the substrate; a gas flow element configured to flow gas between at least one of: (1) the discharge gap, and (2) the pair of electrode extensions; and a structure disposed adjacent the substrate to form an enclosure that substantially encloses at least a region including the discharge gap and the electrode extensions, the enclosure being adapted to contain a plasma.

Abstract: An illumination device provides light to a flowing gaseous sample. The device includes a structure including a cavity configured to have a microplasma disposed therein. The cavity substantially encircles a cross-section of a channel that is configured to pass the flowing gaseous sample therethrough. The cavity is defined in part by an interior wall of the structure separating the cavity from the channel. The interior wall includes at least one orifice passing therethrough configured to provide to the flowing gaseous sample light generated by the microplasma. At least one electrode is configured to supply energy to the microplasma within the cavity.

Abstract: A distributed capacitive/resistive electronic device. An electronic device is described which includes a dielectric substrate, a first resistive component, a second resistive component, and a connecting component. The first resistive component is affixed to a first side of the dielectric substrate. The second resistive component is affixed to a second side of the dielectric substrate, wherein the second side is oppositely located from the first side. The connecting component is affixed to the dielectric substrate, wherein the connecting component electrically connects the first resistive component to the second resistive component, wherein the connecting component is electrically connectable to other electronic circuitry, and wherein, at a location removed from the connecting component, the second resistive component is electrically connectable to other electronic circuitry.

Abstract: A distributed capacitive/resistive electronic device. An electronic device is described which includes a dielectric substrate, a first resistive component, a second resistive component, and a connecting component. The first resistive component is affixed to a first side of the dielectric substrate. The second resistive component is affixed to a second side of the dielectric substrate, wherein the second side is oppositely located from the first side. The connecting component is affixed to the dielectric substrate, wherein the connecting component electrically connects the first resistive component to the second resistive component, wherein the connecting component is electrically connectable to other electronic circuitry, and wherein, at a location removed from the connecting component, the second resistive component is electrically connectable to other electronic circuitry.

Abstract: A leadless chip carrier is attached to a printed circuit board by soldering its input-output connections to the printed circuit board and also by providing an adhesive between a central portion of the leadless chip carrier and the printed circuit board. This adhesive provides increased mechanical strength to the connection, improving its tolerance to temperature cycling. The adhesive used may be the same solder used to make the input-output connections.