Patents by Inventor Martin Li
Martin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230134075Abstract: A method for producing a semiconductor package includes providing a lead frame and a bond pad with a space therebetween. The frame is provided with a die bonded thereon and a die pad. The die, the pad, a part of the frame, a part of the bond pad and the space between the frame and the bond pad are encapsulated. Part of the first encapsulation is removed to create a cavity having a bottom surface including an exposed surface of the die, an exposed surface of the pad, an exposed surface of the bond pad and a connecting region between the exposed surface of the pad and the bond pad. The cavity is partly filled with an electrically conductive paste. The electrically conductive paste is cured to obtain an interconnect between the die pad and the bond pad. The interconnect is encapsulated.Type: ApplicationFiled: November 3, 2022Publication date: May 4, 2023Applicant: NEXPERIA B.V.Inventors: Chi Ho Leung, Shun Tik Yeung, King Man Tai, Ka Shing Martin Li
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Publication number: 20230128519Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: December 20, 2022Publication date: April 27, 2023Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 11539171Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: February 1, 2021Date of Patent: December 27, 2022Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 11456075Abstract: An implantable medical device includes an electronic processing device configured for processing a physiological signal, a memory, and a communication device for communicating with an external device. The processing device includes a coding module for coding the physiological signal to obtain an output signal for transmission by the communication device to the external device. The coding module is configured to encode the physiological signal using at least one fixed Huffman code table stored in the memory to obtain the output signal.Type: GrantFiled: June 5, 2020Date of Patent: September 27, 2022Assignee: BIOTRONIK SE & Co. KGInventors: Shayan Guhaniyogi, Garth Garner, Martin Li, Jon Nels Peterson, R. Hollis Whittington
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Publication number: 20220246595Abstract: A semiconductor device is provided, including a first die, such as a GaN HEMT die, and a second die, such as a MOSFET die, with the second die positioned on the top of the first die. The second die is attached using a die attach adhesive. The semiconductor device further includes an encapsulant deposited on the top of the semiconductor device. The encapsulant is covering the first die and the second die. Metalized vias are created within the encapsulant, and the metalized vias are arranged to distribute terminals of the first die and the terminals of the second die to the top side of the semiconductor device.Type: ApplicationFiled: February 2, 2022Publication date: August 4, 2022Applicant: NEXPERIA B.V.Inventors: On Lok Chau, Fei Wong, Martin Li, Hugo Wong
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Publication number: 20210383920Abstract: An implantable medical device includes an electronic processing device configured for processing a physiological signal, a memory, and a communication device for communicating with an external device. The processing device includes a coding module for coding the physiological signal to obtain an output signal for transmission by the communication device to the external device. The coding module is configured to encode the physiological signal using at least one fixed Huffman code table stored in the memory to obtain the output signal.Type: ApplicationFiled: June 5, 2020Publication date: December 9, 2021Inventors: SHAYAN GUHANIYOGI, GARTH GARNER, MARTIN LI, JON NELS PETERSON, R. HOLLIS WHITTINGTON
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Publication number: 20210159643Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: February 1, 2021Publication date: May 27, 2021Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 10916894Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: December 16, 2019Date of Patent: February 9, 2021Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Publication number: 20200235529Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: December 16, 2019Publication date: July 23, 2020Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 10511128Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: March 22, 2019Date of Patent: December 17, 2019Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Publication number: 20190221973Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: March 22, 2019Publication date: July 18, 2019Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 10243304Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: August 22, 2017Date of Patent: March 26, 2019Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: D813170Type: GrantFiled: August 23, 2016Date of Patent: March 20, 2018Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D818965Type: GrantFiled: August 26, 2016Date of Patent: May 29, 2018Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D835045Type: GrantFiled: August 26, 2016Date of Patent: December 4, 2018Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D841594Type: GrantFiled: February 7, 2018Date of Patent: February 26, 2019Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D843947Type: GrantFiled: February 26, 2018Date of Patent: March 26, 2019Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D899376Type: GrantFiled: January 3, 2019Date of Patent: October 20, 2020Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D902158Type: GrantFiled: October 2, 2018Date of Patent: November 17, 2020Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D980168Type: GrantFiled: October 1, 2020Date of Patent: March 7, 2023Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk