Patents by Inventor Martin Li
Martin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958863Abstract: The present disclosure includes compounds, kits, and assay procedures for use in determining the levels of certain types of drugs in samples that contain specific binding proteins for the drugs. The present disclosure includes analog compounds useful for displacing the drugs from their endogenous binding proteins, and kits including same, as well as methods that utilize these displacers as binding competitors in pharmaceutical assays.Type: GrantFiled: October 25, 2019Date of Patent: April 16, 2024Assignee: Siemens Healthcare Diagnostics Inc.Inventors: Tie Wei, Zhu Teng, Martin Drinan, Jie Li
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Publication number: 20240116985Abstract: Among other things, the present disclosure provides various agents. In some embodiments, provided agents can bind to beta-catenin. In some embodiments, the present disclosure provides technologies for modulating beta-catenin functions. In some embodiments, the present disclosure provides technologies for preventing and/or treating conditions, disorders or diseases associated with beta-catenin. In some embodiments, the present disclosure provides designed amino acids which can provide improved properties and/or activities. In some embodiments, the present disclosure provides agents comprising such amino acids.Type: ApplicationFiled: July 22, 2021Publication date: April 11, 2024Inventors: Brian Halbert White, Yaguang Si, Martin Robert Tremblay, Deborah Gail Conrady, Yue-Mei Zhang, Ivan Tucker Jewett, Lorenzo Josue Alfaro-Lopez, Sarah Isabelle Cappucci, Zhi Li, John Hanney McGee
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Publication number: 20240092746Abstract: Provided herein are opioid receptor modulators and pharmaceutical compositions comprising said compounds.Type: ApplicationFiled: February 13, 2023Publication date: March 21, 2024Inventors: Julio Cesar MEDINA, Alok NERURKAR, Corinne SADLOWSKI, Frederick SEIDL, Heng CHENG, Jason DUQUETTE, John LEE, Martin HOLAN, Pingyu DING, Xiaodong WANG, Tien WIDJAJA, Thomas NGUYEN, Ulhas BHATT, Yihong LI, Zhi-liang WEI
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Patent number: 11931363Abstract: A compound of Formula (I), or a pharmaceutically acceptable salt thereof, is provided that has been shown to be useful for treating a PRC2-mediated disease or disorder: wherein R1, R2, R3, R4, R5, and n are as defined herein.Type: GrantFiled: October 19, 2021Date of Patent: March 19, 2024Assignee: NOVARTIS AGInventors: Ho Man Chan, Xiang-Ju Justin Gu, Ying Huang, Ling Li, Yuan Mi, Wei Qi, Martin Sendzik, Yongfeng Sun, Long Wang, Zhengtian Yu, Hailong Zhang, Ji Yue (Jeff) Zhang, Man Zhang, Qiong Zhang, Kehao Zhao
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Publication number: 20240082765Abstract: The present invention provides a method for treating a used particulate filter, comprising: removing particulates from the particulate filter; and introducing simulated ash into inlet channels of the particulate filter after removing the particulates.Type: ApplicationFiled: December 1, 2021Publication date: March 14, 2024Inventors: Jia Di Zhang, Teng Shen, Jian Li, Wen Ji Song, Tobias Paul, Martin Kalwei, Edgar Viktor Huennekes, Weiyong Tang
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Publication number: 20240079226Abstract: An apparatus for and a method of analyzing a sample. A laser section may include a laser arranged to direct a laser beam in a first direction towards the sample. The laser beam ablating and ionizing at least a portion of the sample to generate ions. An ion source section may include a sample holder for holding the sample. At least one component is arranged to apply an electric field for extracting at least a portion of the ions to form an ion beam traveling in a second direction. A time-of-flight section may include a detector arranged to receive the ion beam.Type: ApplicationFiled: December 21, 2021Publication date: March 7, 2024Inventors: Ankur Chaudhuri, Liqian Li, James Johnston, Martin-Lee Cusick
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Patent number: 11916983Abstract: An online meeting system begins the process of connecting a user to an online meeting when a request is received from a user to start or join the online meeting. In response to the request, a pre-meeting user interface (UI) is displayed having a user interface control which, when activated, enables transmission of audio and/or video data for the online meeting, and prior to activation of the control, connection parameters are shared with an online meeting service to preheat the meeting. In response to activation of the control, transmission of audio and/or video data for the online meeting is enabled.Type: GrantFiled: February 13, 2023Date of Patent: February 27, 2024Assignee: Microsoft Technology Licensing, LLCInventors: Nagaswapna Bhamidipati, Xin He, Milica Jovanovic, Artur Pawel Kania, Namendra Kumar, Rui Liang, Yue Li, Joel Harodi Marquez Catano, Abhilash Chandrasekharan Nair, Gaurav Pancholi, Jindrich Parus, Martin Petrla, Denis Postu, Rama Krishan Prasad Satya Prakash, Kensaku Sueda, Balvinder Kaur Thind, Hao Xu
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Publication number: 20230134075Abstract: A method for producing a semiconductor package includes providing a lead frame and a bond pad with a space therebetween. The frame is provided with a die bonded thereon and a die pad. The die, the pad, a part of the frame, a part of the bond pad and the space between the frame and the bond pad are encapsulated. Part of the first encapsulation is removed to create a cavity having a bottom surface including an exposed surface of the die, an exposed surface of the pad, an exposed surface of the bond pad and a connecting region between the exposed surface of the pad and the bond pad. The cavity is partly filled with an electrically conductive paste. The electrically conductive paste is cured to obtain an interconnect between the die pad and the bond pad. The interconnect is encapsulated.Type: ApplicationFiled: November 3, 2022Publication date: May 4, 2023Applicant: NEXPERIA B.V.Inventors: Chi Ho Leung, Shun Tik Yeung, King Man Tai, Ka Shing Martin Li
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Publication number: 20230128519Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: December 20, 2022Publication date: April 27, 2023Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 11539171Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: February 1, 2021Date of Patent: December 27, 2022Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 11456075Abstract: An implantable medical device includes an electronic processing device configured for processing a physiological signal, a memory, and a communication device for communicating with an external device. The processing device includes a coding module for coding the physiological signal to obtain an output signal for transmission by the communication device to the external device. The coding module is configured to encode the physiological signal using at least one fixed Huffman code table stored in the memory to obtain the output signal.Type: GrantFiled: June 5, 2020Date of Patent: September 27, 2022Assignee: BIOTRONIK SE & Co. KGInventors: Shayan Guhaniyogi, Garth Garner, Martin Li, Jon Nels Peterson, R. Hollis Whittington
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Publication number: 20220246595Abstract: A semiconductor device is provided, including a first die, such as a GaN HEMT die, and a second die, such as a MOSFET die, with the second die positioned on the top of the first die. The second die is attached using a die attach adhesive. The semiconductor device further includes an encapsulant deposited on the top of the semiconductor device. The encapsulant is covering the first die and the second die. Metalized vias are created within the encapsulant, and the metalized vias are arranged to distribute terminals of the first die and the terminals of the second die to the top side of the semiconductor device.Type: ApplicationFiled: February 2, 2022Publication date: August 4, 2022Applicant: NEXPERIA B.V.Inventors: On Lok Chau, Fei Wong, Martin Li, Hugo Wong
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Publication number: 20210383920Abstract: An implantable medical device includes an electronic processing device configured for processing a physiological signal, a memory, and a communication device for communicating with an external device. The processing device includes a coding module for coding the physiological signal to obtain an output signal for transmission by the communication device to the external device. The coding module is configured to encode the physiological signal using at least one fixed Huffman code table stored in the memory to obtain the output signal.Type: ApplicationFiled: June 5, 2020Publication date: December 9, 2021Inventors: SHAYAN GUHANIYOGI, GARTH GARNER, MARTIN LI, JON NELS PETERSON, R. HOLLIS WHITTINGTON
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Publication number: 20210159643Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: February 1, 2021Publication date: May 27, 2021Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 10916894Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: December 16, 2019Date of Patent: February 9, 2021Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Publication number: 20200235529Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: ApplicationFiled: December 16, 2019Publication date: July 23, 2020Applicant: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: 10511128Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.Type: GrantFiled: March 22, 2019Date of Patent: December 17, 2019Assignee: Amphenol CorporationInventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
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Patent number: D899376Type: GrantFiled: January 3, 2019Date of Patent: October 20, 2020Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D902158Type: GrantFiled: October 2, 2018Date of Patent: November 17, 2020Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk
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Patent number: D980168Type: GrantFiled: October 1, 2020Date of Patent: March 7, 2023Assignee: Amphenol CorporationInventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk