Patents by Inventor Martin Lim

Martin Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11366193
    Abstract: A setting of a measurement instrument comprises the providing a reference measurement instrument that uses at least one instrument parameter. A training phase is performed for a particular signal type to be processed by said reference measurement instrument in order to retrieve an optimal setting for said at least one instrument parameter. A lookup table is created for said particular signal type, said lookup table comprising at least said optimal setting for said at least one instrument parameter.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 21, 2022
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Florian Ramian, Darren Tipton, Martin Lim
  • Publication number: 20210088615
    Abstract: A method of setting a measurement instrument comprises the steps of: Providing a reference measurement instrument that uses at least one instrument parameter; Performing a training phase for a particular signal type to be processed by said reference measurement instrument in order to retrieve an optimal setting for said at least one instrument parameter; and Creating a lookup table for said particular signal type, said lookup table comprising at least said optimal setting for said at least one instrument parameter. Further, a system for setting a measurement instrument is described.
    Type: Application
    Filed: September 19, 2019
    Publication date: March 25, 2021
    Inventors: Florian RAMIAN, Darren TIPTON, Martin LIM
  • Patent number: 10935509
    Abstract: The present invention relates to methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: March 2, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Fang Liu, Peter Hartwell, Martin Lim, Yushi Yang
  • Patent number: 10891461
    Abstract: Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: January 12, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Fang Liu, Peter Hartwell, Martin Lim
  • Patent number: 10850973
    Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: December 1, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Michael Daneman, Martin Lim, Kegang Huang, Igor Tchertkov
  • Publication number: 20200173946
    Abstract: The present invention relates to methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
    Type: Application
    Filed: February 10, 2020
    Publication date: June 4, 2020
    Inventors: Fang Liu, Peter Hartwell, Martin Lim, Yushi Yang
  • Publication number: 20200109045
    Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
    Type: Application
    Filed: November 27, 2019
    Publication date: April 9, 2020
    Inventors: Michael DANEMAN, Martin LIM, Kegang HUANG, Igor TCHERTKOV
  • Patent number: 10598621
    Abstract: The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 24, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Fang Liu, Peter Hartwell, Martin Lim, Yushi Yang
  • Patent number: 10532926
    Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: January 14, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Michael Daneman, Martin Lim, Kegang Huang, Igor Tchertkov
  • Patent number: 10508022
    Abstract: MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: December 17, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Michael J. Daneman, Martin Lim, Xiang Li, Li-Wen Hung
  • Patent number: 10488274
    Abstract: Acoustic ambient temperature and humidity sensing based on determination of sound velocity is described, in addition to sensors, algorithms, devices, systems, and methods therefor. An exemplary embodiment employs sound velocity in the determination of ambient temperature and humidity. Provided implementations include determinations of sound velocity based on time of flight of a coded acoustic signal and/or based on resonance frequency of a Helmholtz resonator.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 26, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Xiang Li, Omid Oliaei, Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim
  • Patent number: 10343897
    Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: July 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim, Aleksey S. Khenkin
  • Patent number: 10221065
    Abstract: An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two cross-sections a top surface of the outgassing source layer is not covered by the outgassing barrier layer and in the other of the two cross-sections the outgassing source layer is encapsulated in the outgassing barrier layer. The method also includes depositing conformally a second outgassing barrier layer and etching the second outgassing barrier layer such that a spacer of the second outgassing barrier layer is left on sidewalls of the outgassing source layer.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: March 5, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Daesung Lee, Jongwoo Shin, Jong Il Shin, Peter Smeys, Martin Lim
  • Patent number: 10160635
    Abstract: MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: December 25, 2018
    Assignee: INVENSENSE, INC.
    Inventors: Michael J. Daneman, Martin Lim, Xiang Li, Li-Wen Hung
  • Publication number: 20180340901
    Abstract: The present invention relates to low power, low cost, and compact gas sensors and methods for making the same. In one embodiment, the gas sensor includes a heating element embedded in a suspended structure overlying a substrate. The heating element is configured to generate an amount of heat to bring the chemical sensing element to an operating temperature. The chemical sensing element is thermally coupled to the heating element. The chemical sensing element is also exposed to an environment that contains the gas to be measured. In one embodiment, the chemical sensing element comprises a metal oxide compound having an electrical resistance based on the concentration of a gas in the environment and the operating temperature of the chemical sensing element. In this embodiment, the operating temperature of the chemical sensing element is greater than room temperature and determined by the amount of heat generated by the heating element.
    Type: Application
    Filed: July 18, 2018
    Publication date: November 29, 2018
    Inventors: Fang Liu, Martin Lim, Baris Cagdaser
  • Publication number: 20180336390
    Abstract: Facilitating live fingerprint detection utilizing an integrated ultrasound and infrared (IR) sensor is presented herein. A fingerprint sensor can comprise a first substrate comprising the IR sensor, and a second substrate comprising an ultrasonic transducer. The second substrate is attached to a top portion of the first substrate, and a temperature output of the IR sensor facilitates a determination that a fingerprint output of the ultrasonic transducer corresponds to a finger. The IR sensor can comprise polysilicon comprising a thermopile and an array of photonic crystals thermally coupled to the thermopile.
    Type: Application
    Filed: May 22, 2017
    Publication date: November 22, 2018
    Inventors: Fang Liu, Peter Hartwell, Martin Lim
  • Publication number: 20180312394
    Abstract: MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The MEMS device also includes a device layer having a third and fourth surface, the third surface bonded to the insulating layer of the second surface of handle wafer; and a metal conductive layer on the fourth surface. The MEMS device also includes CMOS wafer bonded to the MEMS wafer. The CMOS wafer includes at least one metal electrode, such that an electrical connection is formed between the at least one metal electrode and at least a portion of the metal conductive layer.
    Type: Application
    Filed: April 3, 2017
    Publication date: November 1, 2018
    Inventors: Michael J. DANEMAN, Martin LIM, Xiang LI, Li-Wen HUNG
  • Publication number: 20180292338
    Abstract: The present invention relates to systems and methods for detecting gases in an environment using chemical and thermal sensing. In one embodiment, a method includes exposing a chemiresistor embedded within a sensor pixel to a gas in an environment; setting a heater embedded within the sensor pixel to a sensing temperature, the sensing temperature being greater than room temperature; measuring an electrical resistance of the chemiresistor in response to setting the heater to the sensing temperature; and in response to a difference between the electrical resistance of the chemiresistor and a reference electrical resistance being less than a threshold, supplying a fixed power input to the heater embedded within the sensor pixel and measuring a temperature of the sensor pixel relative to a reference temperature.
    Type: Application
    Filed: April 11, 2017
    Publication date: October 11, 2018
    Inventors: Fang Liu, Peter Hartwell, Martin Lim, Yushi Yang
  • Patent number: 10093533
    Abstract: A sensor chip includes a first substrate with a first surface and a second surface including at least one CMOS circuit, a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate, a second substrate, a second MEMS substrate, and a third substrate including at least one CMOS circuit. The first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate. The second surface of the first MEMS substrate is attached to the second substrate. The first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: October 9, 2018
    Assignee: InvenSense, Inc.
    Inventors: Peter Smeys, Martin Lim
  • Publication number: 20180217008
    Abstract: Acoustic ambient temperature and humidity sensing based on determination of sound velocity is described, in addition to sensors, algorithms, devices, systems, and methods therefor. An exemplary embodiment employs sound velocity in the determination of ambient temperature and humidity. Provided implementations include determinations of sound velocity based on time of flight of a coded acoustic signal and/or based on resonance frequency of a Helmholtz resonator.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 2, 2018
    Inventors: Xiang Li, Omid Oliaei, Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim