Abstract: The present invention relates to a flexible closed belt conveyor (1) optimized for the requirements in the food industry, the belt comprising a flexible plastic sheet and edge bands welded to the longitudinal edges of the plastic sheet, wherein said endless element is adapted to form a pouch for carrying goods and wherein the maximum thickness of the plastic sheet is less than 1 mm. The invention also deals with a device for balancing the tension between the two edge bands by separating the edge bands in a portion of its pathway.

Abstract: A method for producing an electrical feedthrough in a substrate having an electrical feedthrough, including: forming an etch stop layer on the front side of the substrate; forming a mask on the back side of the substrate; forming an annular trench in the substrate, which trench extends from the back to the front side, by an etching process that stops at the etch stop layer, using the mask, the trench surrounding a substrate punch; depositing a metal layer over the back side of the substrate using the mask, the metal layer penetrating into the annular trench and being deposited on the substrate punch; forming a metal silicide layer on the substrate punch by at least partially converting the metal layer into the metal silicide layer on the substrate punch; selectively removing a remainder of the metal layer; and closing off the annular trench at the back side of the substrate.

Abstract: The present invention relates to a flexible closed belt conveyor (1) optimized for the requirements in the food industry, the belt comprising a flexible plastic sheet and edge bands welded to the longitudinal edges of the plastic sheet, wherein said endless element is adapted to form a pouch for carrying goods and wherein the maximum thickness of the plastic sheet is less than 1 mm. The invention also deals with a device for balancing the tension between the two edge bands by separating the edge bands in a portion of its pathway.

Abstract: A method for producing an electrical feedthrough in a substrate having an electrical feedthrough, including: forming an etch stop layer on the front side of the substrate; forming a mask on the back side of the substrate; forming an annular trench in the substrate, which trench extends from the back to the front side, by an etching process that stops at the etch stop layer, using the mask, the trench surrounding a substrate punch; depositing a metal layer over the back side of the substrate using the mask, the metal layer penetrating into the annular trench and being deposited on the substrate punch; forming a metal silicide layer on the substrate punch by at least partially converting the metal layer into the metal silicide layer on the substrate punch; selectively removing a remainder of the metal layer; and closing off the annular trench at the back side of the substrate.