Abstract: The illumination module for emitting light (5) can operate in at least two different modes, wherein in each of the modes, the emitted light (5) has a different light distribution. The module has a mode selector (10) for selecting the mode in which the module operates, and it has an optical arrangement. The arrangement includes—a microlens array (LL1) with a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P (P1);—an illuminating unit for illuminating the microlens array (LL1). The illuminating unit includes a first array of light sources (S1) operable to emit light of a first wavelength L1 each and having an aperture each. The apertures are located in a common emission plane which is located at a distance D (D1) from the microlens array (LL1). In a first one of the modes, for the lens pitch P, the distance D and the wavelength L1 applies P2=2·L1·D/N wherein N is an integer with N?1.

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

Abstract: The disclosure describes packages having portions of a lead frame as electrically conductive leads. The conductive leads can facilitate bringing signals acquired at the top of a package down to electrically conductive pads at the bottom of the package (or vice-versa). The techniques can be used in a range of different applications, for example, the monitoring of signals to enhance the safety of a light emitting package, as well as other applications in which a signal acquired at a top side of an package needs to be brought to conductive pads at a bottom side of the package, or to bring signals from conductive pads at the bottom side of the package to the top side of the package.

Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.

Abstract: An illumination module for generating a patterned illumination with minimal ambiguity includes an array of light sources having different respective near-field intensity profiles. The illumination module also includes an optical assembly. The optical assembly and the array of light sources can be operable to substantially replicate the different respective near-field intensity profiles of the light sources in the far-field thereby generating a patterned illumination. The patterned illumination can exhibit reduced ambiguity in some instances.

Abstract: A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

Abstract: An illumination module for generating a patterned illumination with minimal ambiguity includes an array of light sources having different respective near-field intensity profiles. The illumination module also includes an optical assembly. The optical assembly and the array of light sources can be operable to substantially replicate the different respective near-field intensity profiles of the light sources in the far-field thereby generating a patterned illumination. The patterned illumination can exhibit reduced ambiguity in some instances.

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.

Abstract: The illumination module for emitting light (5) can operate in at least two different modes, wherein in each of the modes, the emitted light (5) has a different light distribution. The module has a mode selector (10) for selecting the mode in which the module operates, and it has an optical arrangement. The arrangement includes—a microlens array (LL1) with a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P (P1);—an illuminating unit for illuminating the microlens array (LL1). The illuminating unit includes a first array of light sources (S1) operable to emit light of a first wavelength L1 each and having an aperture each. The apertures are located in a common emission plane which is located at a distance D (D1) from the microlens array (LL1). In a first one of the modes, for the lens pitch P, the distance D and the wavelength L1 applies P2=2·L1·D/N wherein N is an integer with N?1.

Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N?1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

Abstract: A thermally tunable optoelectronic module includes a light emitting assembly operable to emit light of a particular wavelength or range of wavelengths. The light emitting assembly is disposed to a temperature-dependent wavelength shift. The thermally tunable optoelectronic module further includes an optical assembly aligned to the light emitting assembly, and separated from the light emitting assembly by an alignment distance. The thermally tunable optoelectronic module further includes a thermally tunable spacer disposed between the optical assembly and the light-emitting assembly, the thermally tunable spacer is operable to counteract the temperature-dependent wavelength shift.

Abstract: An eye-safe optoelectronic module includes a light source mounted on a support and operable to generate light along an emission axis. An eye-safe substrate has an eye-safe substrate refractive index and includes at least one diffusive surface. The eye-safe substrate is mounted such that the emission axis is intercepted by the diffusive surface. An optical assembly includes at least one optical element, is composed of an optical material and is mounted on the diffusive surface of the eye-safe substrate such that the optical material fills a diffusive surface of the eye-safe substrate. The optical assembly has an optical assembly refractive index that is substantially the same as the eye-safe substrate refractive index.