Abstract: Disclosed herein is a virtual cache and method in a processor for supporting multiple threads on the same cache line. The processor is configured to support virtual memory and multiple threads. The virtual cache directory includes a plurality of directory entries, each entry is associated with a cache line. Each cache line has a corresponding tag. The tag includes a logical address, an address space identifier, a real address bit indicator, and a per thread validity bit for each thread that accesses the cache line. When a subsequent thread determines that the cache line is valid for that thread the validity bit for that thread is set, while not invalidating any validity bits for other threads.

Abstract: Systems, apparatuses, and methods for transmission failure feedback associated with a memory device are described. A memory device may detect errors in received data and transmit an indication of the error when detected. The memory device may receive data and checksum information for the data from a controller. The memory device may generate a checksum for the received data and may detect transmission errors. The memory device may transmit an indication of detected errors to the controller, and the indication may be transmitted using a line that is different than an error detection code (EDC) line. A low-speed tracking clock signal may also be transmitted by the memory device over a line different than the EDC line. The memory device may transmit a generated checksum to the controller with a time offset applied to the checksum signaled over the EDC line.

Abstract: Methods, systems, and devices for tracking a reference voltage (also referred to as VREFD) after boot-up are described. For example, a host device or a memory device may determine a temperature value associated with the memory device. The host device or the memory device may select a reference voltage offset value for the memory device based on mapping the temperature value associated with the memory device to a relationship between reference voltage offset values and temperature differential values associated with the memory device. The host device or the memory device may adjust a reference voltage value associated with the memory device based on the reference voltage offset value. The host device, or the memory device, may operate the memory device in accordance with the reference voltage value based on adjusting the reference voltage value.

Abstract: A carrier structure is provided. The carrier structure may include an electrically insulating carrier, wherein the carrier is thermally conductive. The carrier includes a core of an electrically insulating material, a first metal layer applied to a first side of the core, and a second metal layer applied to a second side of the core, wherein the second side is opposite the first side. A first exposed solder layer is located on the first metal layer, and a second exposed solder layer is located on the second metal layer.

Abstract: Methods, systems, and devices for operating memory cell(s) using adapting the current on a channel are described. A current on a channel may be adapted during a transition period between signaling a first logic value over the channel and signaling a second (e.g. subsequent) logic value over the channel. Adapting the current may include increasing or decreasing the current on the channel during the transition period. The degree of adaptation may be based on a difference between the first logic value and the subsequent logic value. In some cases, a logic circuit may be configured to determine a difference between the first and subsequent logic value. The logic circuit may be further configured to communicate the difference to an adaptive driver. And the adaptive driver may adapt a current of the channel based on the communicated difference.

Abstract: The present invention relates to a method for purifying a Factor VIII (FVIII) subspecies from a composition comprising FVIII, said method comprising an anion exchange chromatography step, a size exclusion chromatography step, and a concentration step. The invention also relates to a composition comprising a purified FVIII subspecies.

Abstract: In some embodiments, a method can include detecting, at a first circuit, the first circuit being operatively coupled to a memory device having a set of memory portions. The method can include receiving, from the memory device and at the first circuit, a set of encryption key portions after the detecting, each encryption key portion from the encryption key portions being a unique portion of an encryption key. The method can include assembling the encryption key by ordering each encryption key portion from the set of encryption key portions based on (1) a first previously defined list and (2) a second previously defined list. The first previously defined list and the second previously defined list each is stored at or accessible by the first circuit but not stored at or accessible by the memory device. The method can include authorizing access to a second circuit based on the encryption key.

Abstract: A semiconductor device contains a chip carrier and a semiconductor chip arranged on the chip carrier. Furthermore, the semiconductor device comprises an intermediate layer arranged between the chip carrier and the semiconductor chip, and an encapsulation material at least partially encapsulating the semiconductor chip. Filler particles are embedded in at least one of the interlayer or the encapsulation material, wherein the filler particles contain a semiconductor material with a band gap in a range from 2.3 eV to 3.6 eV.

Abstract: A geodetic surveying device, wherein the geodetic surveying device is configured for surveying retroreflective cooperative targets, the geodetic surveying device comprising a base, a telescope and a support. The geodetic surveying device further comprises a target recognition emitting unit, called ATR-illuminator, an target recognition sensor, called ATR-sensor, an angle encoder and a processing unit. The geodetic surveying device is configured to distinguish desired targets from undesired targets, wherein the geodetic surveying device further comprises a classification model, wherein the classification model is configured for classification of retroreflective targets generating spots, wherein the retroreflective targets are classified into desired targets and undesired targets, wherein the classification is carried out by applying the classification model on the spot.

Abstract: A geodetic surveying device, wherein the geodetic surveying device is configured for surveying retroreflective cooperative targets, the geodetic surveying device comprises a base, a telescope and a support. The geodetic surveying device further comprises a target recognition emitting unit, called ATR-illuminator, an target recognition sensor, called ATR-sensor, having a position-sensitive area for receiving radiation of the radiation beam reflected at the retroreflective cooperative targets for generating ATR image data, wherein the received radiation appear as spots in the ATR image data, an angle encoder and a processing unit. The geodetic surveying device generates a series of ATR image data with continuously changing orientation of the ATR-illuminator and/or the ATR-sensor.

Abstract: A power semiconductor module includes a substrate of planar sheet metal including a plurality of islands that are each defined by channels that extend between upper and lower surfaces of the substrate, a first semiconductor die mounted on a first one of the islands, a molded body of encapsulant that covers the metal substrate, fills the channels, and encapsulates the first semiconductor die, a hole in the molded body that extends to a recess in the upper surface of the substrate, and a press-fit connector arranged in the hole such an interior end of the press-fit connector is mechanically and electrically connected to the substrate.

Abstract: A sensor device comprises an array of photodetectors. A multiplexer circuit is connected to the array of photodetectors and provides dedicated output paths for each photodetector in the array, respectively. Furthermore, the sensor device comprises at least one control terminal. An array of time-to-digital converters is connected to output terminals of the multiplexer circuit. Depending on a control signal to be applied at the at least one control terminal, the multiplexer circuit is arranged to electrically connect only the output paths of a subarray of photodetectors to the output terminals of the multiplexer circuit.

Abstract: A device monitors for bearing capacity failure of a mobile work machine. The work machine has a number of stabilisers. Each stabiliser has a support foot having a support foot plate. When the mobile work machine is in a supported state, the support foot plate of at least one support foot is arranged on a base surface surrounding the work machine or on a base plate. The device for bearing capacity failure monitoring has a number of sensors for sensing a change in position of at least one support foot plate and/or at least one base plate. The device has an evaluation unit, which has a data connection to the number of sensors and is designed to detect a bearing capacity failure on the basis of a change in position of the at least one support foot plate and/or the at least one base plate that has been sensed by means of the number of sensors.

Abstract: A semiconductor device contains an electrically conductive carrier and a semiconductor chip arranged on the carrier. Furthermore, the semiconductor device contains a layer stack arranged between the carrier and the semiconductor chip and having a plurality of dielectric layers. The layer stack galvanically isolates the semiconductor chip and the carrier from one another. At least one of the plurality of dielectric layers is coated with an electrically conductive coating.

Abstract: In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

Abstract: A semiconductor device contains a chip carrier and a semiconductor chip arranged on the chip carrier. Furthermore, the semiconductor device comprises an intermediate layer arranged between the chip carrier and the semiconductor chip, and an encapsulation material at least partially encapsulating the semiconductor chip. Filler particles are embedded in at least one of the interlayer or the encapsulation material, wherein the filler particles contain a semiconductor material with a band gap in a range from 2.3 eV to 3.6 eV.

Abstract: A measuring device for acquiring a three-dimensional measuring point related to a target in a scene, the measuring device comprises a distance measuring unit comprising an emitting unit configured for emitting collimated measuring radiation (T) and a receiving unit configured for detecting at least a part of the collimated measuring radiation reflected (R) by the target, a directing unit rotatable around an elevation axis and configured for directing the measuring radiation towards the scene, a capturing unit, wherein the capturing unit comprises an image sensor and is configured to capture at least a scene image of at least part of the scene, and a controlling and processing unit configured at least for aligning the directing unit.

Abstract: A measuring device for acquiring a three-dimensional measuring point related to a target in a scene, the measuring device comprises a base unit, a support unit mounted on the base unit, a distance measuring unit comprising an emitting unit configured for emitting measuring radiation and a receiving unit configured for detecting at least a part of the measuring radiation reflected by the target and a directing unit mounted in the support unit configured for directing the measuring radiation towards the scene. The measuring device comprises a capturing unit, wherein the capturing unit is configured for capturing at least a scene image of at least part of the scene, the scene image is generated by the detection of visual-spectrum light, and a controlling and processing unit, wherein the controlling and processing unit is configured for aligning the directing unit.

Abstract: A device includes a radio frequency chip and a heat sink arranged over the radio frequency chip. The device further includes a layer stack arranged between the radio frequency chip and the heat sink. The layer stack includes a first layer including a first material, a thermal interface material, and a metal layer arranged between the first material and the thermal interface material.

Abstract: In a method for controlling a distributor roller of a printing press, the phase position of at least one reversal point of the distributor roller is changed automatically during the ongoing printing. A change is made to the phase position for every specified number of revolutions of a plate cylinder.