Patents by Inventor Martin McHugh

Martin McHugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8829684
    Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: September 9, 2014
    Assignee: Microsemi Semiconductor Limited
    Inventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
  • Publication number: 20140070421
    Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.
    Type: Application
    Filed: November 20, 2013
    Publication date: March 13, 2014
    Applicant: MICROSEMI SEMICONDUCTOR LIMITED
    Inventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
  • Patent number: 8643192
    Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: February 4, 2014
    Assignee: Microsemi Semiconductor Limited
    Inventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
  • Publication number: 20120292781
    Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 22, 2012
    Applicant: MICROSEMI SEMICONDUCTOR LIMITED
    Inventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
  • Publication number: 20050174745
    Abstract: An electronic assembly (30) comprises a substrate element (32) having a mounting surface (34), circuitry (38) disposed on the mounting surface (34), an edge surface (36) at the periphery of and distinct from the mounting surface (34), and an electrically-conductive track (40) extending from the circuitry (38) along at least part of the edge surface (36) to form at least one electronic component. The conductive track (40) can be used to form an electronic component such as antenna, an inductor or a resistor, and results in a highly efficient use of the available substrate surface area.
    Type: Application
    Filed: January 7, 2005
    Publication date: August 11, 2005
    Inventors: Michael Higgins, Tom Collins, Martin McHugh