Patents by Inventor Martin McHugh
Martin McHugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240127199Abstract: A system for interfacing predetermined services to a user at a fixed location includes a processing platform running an operating system. The system further includes a data store for storing configuration information for enabling the operating system to interface with available physical system resources through the physical system resource interface associated therewith. A communication resource for interfacing with the operating system allows communication of the operating system with a central office for downloading configuration information to selectively enable ones of the available physical system resources to interface with the operating system through associated ones of the physical system resource interfaces in accordance with the configuration information and the predetermined service selected by a user. A plurality of configurations is stored in the data store, and each is associated with a predetermined service and one or more of the available physical system resources.Type: ApplicationFiled: December 22, 2023Publication date: April 18, 2024Inventors: ANTHONY M. CACHERIA, III, DAVID HOOKER, Wayne Thomas McHUGH, KRISTOPHER GLOVER, WEBB EDWARDS, Arthur Martin HOLBROOK, BARRETT JENKINS, Mohamed Safir SALIHU, Purnendu MISHRA
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Patent number: 11961105Abstract: A method of enabling an employee to utilize earned and unpaid earnings includes receiving, with a with a central office processor, a record of an employee's accrued and unpaid earnings for a predetermined time period and storing the record in a database. The method further includes receiving, with the central office processor, an electronic request from an employee to access the employee's record of accrued and unpaid earnings for the predetermined time period. Upon receipt of the request, the central office processor accesses the database including the record of the employee's accrued and unpaid earnings for the predetermined time period and determines an amount of the employee's accrued and unpaid earnings for the predetermined time period available to the employee and transmits the amount for display to the employee.Type: GrantFiled: October 24, 2014Date of Patent: April 16, 2024Assignee: GANART TECHNOLOGIES, INC.Inventors: Mohamed Safir Salihu, Wayne Thomas McHugh, Arthur Martin Holbrook, Purnendu Mishra, Lee Coleman
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Patent number: 11922381Abstract: A distributed transaction system for enabling users to conduct transactions using services from third party service providers includes a central processing center with one or more communications interfaces to facilitate transactions initiated by users at a plurality of kiosks wherein each of the kiosks includes a user interface enabling a user to access a user selected service and a data store for storing configurations associated with services provided by the third party service providers, whereby a user interfaces with one or more of physical system resources of the kiosk to open a user identity session such that the kiosk is operative to facilitate at least one first user action with the physical resources to initiate a financial transaction and the central processing center is operative to execute at least a second action to facilitate the transaction and to communicate with a financial institution.Type: GrantFiled: March 12, 2018Date of Patent: March 5, 2024Assignee: Ganart Technologies, Inc.Inventors: Anthony M. Cacheria, III, David Hooker, Wayne Thomas McHugh, Kristopher Glover, Webb Edwards, Arthur Martin Holbrook, Barrett Jenkins, Purnendu Mishra, Mohamed Safir Salihu
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Patent number: 8829684Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.Type: GrantFiled: November 20, 2013Date of Patent: September 9, 2014Assignee: Microsemi Semiconductor LimitedInventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
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Publication number: 20140070421Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.Type: ApplicationFiled: November 20, 2013Publication date: March 13, 2014Applicant: MICROSEMI SEMICONDUCTOR LIMITEDInventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
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Patent number: 8643192Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.Type: GrantFiled: May 16, 2012Date of Patent: February 4, 2014Assignee: Microsemi Semiconductor LimitedInventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
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Publication number: 20120292781Abstract: An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.Type: ApplicationFiled: May 16, 2012Publication date: November 22, 2012Applicant: MICROSEMI SEMICONDUCTOR LIMITEDInventors: Piers Tremlett, Michael Anthony Higgins, Martin McHugh
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Publication number: 20050174745Abstract: An electronic assembly (30) comprises a substrate element (32) having a mounting surface (34), circuitry (38) disposed on the mounting surface (34), an edge surface (36) at the periphery of and distinct from the mounting surface (34), and an electrically-conductive track (40) extending from the circuitry (38) along at least part of the edge surface (36) to form at least one electronic component. The conductive track (40) can be used to form an electronic component such as antenna, an inductor or a resistor, and results in a highly efficient use of the available substrate surface area.Type: ApplicationFiled: January 7, 2005Publication date: August 11, 2005Inventors: Michael Higgins, Tom Collins, Martin McHugh