Patents by Inventor Martin Morales

Martin Morales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962989
    Abstract: Audio signals are obtained and filtered. First and second audio processing tools are selected, and priorities associated with the first and second audio processing tools are assigned. In response to a higher priority associated with the first audio processing tool, the audio signal is encoded using the first audio processing tool. A multi-channel audio format for decoding the encoded may be selected and the encoded audio signal is decoded to the selected multi-channel audio format. Further, metadata associated with audio objects may be obtained. A gain level for each audio object may be determined based on the metadata and the gain level may be adjusted using the second audio processing tool. Another multi-channel audio format may be selected, and the gain level adjusted audio signal may be encoded based on the other selected multi-channel audio format. The gain level adjusted audio signal is output to be rendered via playback devices.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 16, 2024
    Assignee: ORBITAL AUDIO LABORATORIES, INC.
    Inventors: Enrique Martin Morales, Jaycen Joshua, Michael Seaberg
  • Publication number: 20240071233
    Abstract: Systems and methods of a monitoring node to assist an air navigation service provider (ANSP) in the design of an airspace. The monitoring node collects flight data and performs flight simulations for a large geographic region that is outside of the airspace. The monitoring node receives flight data collected by the ANSP for the airspace. The monitoring node supplements their flight data with the data received from the ANSP and performs flight simulations and generates flight plans for the airspace. The flight simulations and flight plans are transmitted to the ANSP which are then used by the ANSP to design the airspace.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Serguei R. Tiourine, John Vince, Curt Alexander Hjorring, Mats Åke Thomas Lindström, Karl Jonas Alexander Kruuse, Carl Martin Smedstad, Michael Milakovic, Manuel Polaina Morales
  • Publication number: 20220021997
    Abstract: Audio signals are obtained and filtered. First and second audio processing tools are selected, and priorities associated with the first and second audio processing tools are assigned. In response to a higher priority associated with the first audio processing tool, the audio signal is encoded using the first audio processing tool. A multi-channel audio format for decoding the encoded may be selected and the encoded audio signal is decoded to the selected multi-channel audio format. Further, metadata associated with audio objects may be obtained. A gain level for each audio object may be determined based on the metadata and the gain level may be adjusted using the second audio processing tool. Another multi-channel audio format may be selected, and the gain level adjusted audio signal may be encoded based on the other selected multi-channel audio format. The gain level adjusted audio signal is output to be rendered via playback devices.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 20, 2022
    Inventors: Enrique Martin Morales, Jaycen Joshua
  • Publication number: 20170328055
    Abstract: A shelter system is disclosed. Said shelter system comprises a shelter, a one or more ground anchors and a life support system. Said shelter comprises a plurality of hooks, a one or more sockets, a frame, said life support system, a plurality of walls, a roof and a floor. Said shelter weighs less than 8000 pounds. Said frame is a metal frame. Said life support system comprises a plumbing system, an electrical system, an air filter system and a HVAC system. Said shelter system comprises a suspension system. Said suspension system comprises a ring, an upper tether cables and a lower tether cables. Said frame comprises a roof support, a roof studs, a first set of studs, a second set of studs and a one or more wall studs. Said floor comprises said one or more sockets, an outer layer, a floor support, a vertical supports and a horizontal supports.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 16, 2017
    Inventor: Martin Morales
  • Patent number: 7090189
    Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: August 15, 2006
    Assignee: Sandia National Laboratories
    Inventors: Alfredo Martin Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry Joseph Garino
  • Publication number: 20030057096
    Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.
    Type: Application
    Filed: August 15, 2002
    Publication date: March 27, 2003
    Inventors: Alfredo Martin Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry Joseph Garino
  • Patent number: 6458263
    Abstract: In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: October 1, 2002
    Assignee: Sandia National Laboratories
    Inventors: Alfredo Martin Morales, Linda A. Domeier
  • Patent number: 6245849
    Abstract: A method is provided for fabricating ceramic microstructures, i.e., microcomponents of micron or submicron dimensions. A polymer composition is prepared containing a polymer, typically a thermally or chemically curable polymer, and nanometer size (1 to 1000 nm in diameter) ceramic particles. A mold, such as a lithographically patterned mold, preferably a LIGA mold, is filled with the polymer composition and the polymer is then cured or otherwise hardened. The elevated segments of the mold are then removed. The surface-attached ceramic microstructures so provided may then be removed from the substrate and, if desired, pyrolyzed and sintered.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: June 12, 2001
    Assignee: Sandia Corporation
    Inventors: Alfredo Martin Morales, Z. John Zhang, Douglas Chinn