Abstract: The invention relates to a method for producing a power module (1) and a power module (1), in particular for a medium or high voltage converter (2), comprising at least one power semiconductor module (3), at least one energy storage module (5), at least one cooling device (7), at least two busbars (10), wherein the cooling device (7) is configured to be electrically conductive and is connected to a protective housing (19) shielding at least the power semiconductor module (3) from the environment, which protective housing (19) has at least one insertion opening (20) for inserting and fastening a connecting element (15), and an electrically conductive connecting element (15) is arranged at a predefinable connection position (16) between at least the cooling device (7) and one of the busbars (10) for forming a defined charge-reversal path (17).

Abstract: The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

Abstract: The invention relates to a power module (4) for a medium or high voltage converter (1), preferably a modular multilevel converter, comprising at least one power semiconductor module (7), preferably an IGBT assembly, at least one energy storage module (9), preferably a capacitor module, at least one cooling device (14), wherein the cooling device (14) is formed as a cooling plate (17) that can be run through by a coolant, in particular flown through by a cooling liquid, and the at least one power semiconductor module (7) and/or the at least one energy storage module (9) are arranged on an upper side (18) and/or bottom side (19) of the cooling plate (17), and wherein the at least the power semiconductor module (7) is connected with the cooling plate (17) in a thermally conductive manner, and wherein the cooling plate (17) is provided for load-bearing support on a rack (2) of an assigned receiving space (3) of the medium or high voltage converter (1) and comprises support surfaces (16) projecting laterally in th

Abstract: The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

Abstract: The invention relates to a power module (4) for a medium or high voltage converter (1), preferably a modular multilevel converter, comprising at least one power semiconductor module (7), preferably an IGBT assembly, at least one energy storage module (9), preferably a capacitor module, at least one cooling device (14), wherein the cooling device (14) is formed as a cooling plate (17) that can be run through by a coolant, in particular flown through by a cooling liquid, and the at least one power semiconductor module (7) and/or the at least one energy storage module (9) are arranged on an upper side (18) and/or bottom side (19) of the cooling plate (17), and wherein the at least the power semiconductor module (7) is connected with the cooling plate (17) in a thermally conductive manner, and wherein the cooling plate (17) is provided for load-bearing support on a rack (2) of an assigned receiving space (3) of the medium or high voltage converter (1) and comprises support surfaces (16) projecting laterally in th

Abstract: The invention relates to a method and a modular holding and exchanging system (1) for medium or high voltage converters, preferably a modular multilevel converter, comprising a rack (2) for receiving at least two power modules (3) arranged on top of one another in receiving spaces (4), wherein the rack (2) has at least two pairs of vertical standing elements (5) and at least two carrier elements (6) connecting the vertical standing elements (5) in a longitudinal direction (10) of the rack (2) in a horizontal support plane (9), a lifting tool (7) that can be coupled with the rack (2), which lifting tool (7) comprises at least one, preferably at least two, rolling bodies (19) that can be adjusted between a rest position (13) and a support and/or service position (14) for temporarily raising and/or moving a power module (4), wherein the power modules (4) have support surfaces (16) projecting in a transverse direction (11) with respect to a housing width (15) for being supported on the carrier elements (6), and t

Abstract: The invention relates to a method for producing a power module (1) and a power module (1), in particular for a medium or high voltage converter (2), comprising at least one power semiconductor module (3), at least one energy storage module (5), at least one cooling device (7), at least two busbars (10), wherein the cooling device (7) is configured to be electrically conductive and is connected to a protective housing (19) shielding at least the power semiconductor module (3) from the environment, which protective housing (19) has at least one insertion opening (20) for inserting and fastening a connecting element (15), and an electrically conductive connecting element (15) is arranged at a predefinable connection position (16) between at least the cooling device (7) and one of the busbars (10) for forming a defined charge-reversal path (17).

Abstract: The invention relates to a method for operating an inverter (1) and to an inverter (1) for converting a direct voltage (UDC) into an alternating voltage (UAC) with a specified grid frequency (fAC) for supplying loads (12) and/or feeding into a supply grid (13), comprising a direct voltage input (2) and multiple AC power units (6) which are connected in parallel and comprise semiconductor switches (7) in a bridge circuit and freewheeling diodes (8) arranged parallel thereto. The outputs of the AC power units (6) are connected to an alternating voltage output (10) via a respective inductivity (9).

Abstract: The invention relates to a method for operating an inverter (1) and to an inverter (1) for converting a direct voltage (UDC) into an alternating voltage (UAC) with a specified grid frequency (fAC) for supplying loads (12) and/or feeding into a supply grid (13), comprising a direct voltage input (2) and multiple AC power units (6) which are connected in parallel and comprise semiconductor switches (7) in a bridge circuit and freewheeling diodes (8) arranged parallel thereto. The outputs of the AC power units (6) are connected to an alternating voltage output (10) via a respective inductivity (9).