Abstract: Slot transmission lines are formed in dielectric substrates. Several of such substrates can be stacked together. When stacked together, the conductive surfaces that form the transmission lines can be terminated in the same plane whereat the conductive surfaces form contact terminals. The co-planar contact terminals can be coupled to contact points on a circuit board. Signals on the circuit board can thereby be coupled into the slot transmission lines that extend through the dielectric substrates.

Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. In the via arrangement, sets of differential signal pair vias and an associated ground are arranged adjacent to each other in a repeating pattern. The differential signal vias of each pair are spaced closer to their associated ground via than the spacing between the adjacent differential signal pair associated ground so that differential signal vias exhibit a preference for electrically coupling to their associated ground vias. The circuit trace exit structure involves the exit portions of the circuit traces of the differential signal vias to follow a path where they meet with and join to the transmission lines portions of the traces.

Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.