Abstract: A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

Abstract: A laser processing system includes a first positioning system (1044) for imparting first relative movement of a beam axis along a beam trajectory (1062) with respect to a workpiece (1060), a processor for determining a second relative movement of the beam axis (1061) along a plurality of dither rows, a second positioning system (1042) for imparting the second relative movement, and a laser source (1046) for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations (5310) one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.