Patents by Inventor Martin Otto

Martin Otto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070209469
    Abstract: The invention relates to an actuating device for a parking brake of a motor vehicle, with at least one lever which is operatively connected to the parking brake via traction means and which is mounted such that it can pivot between a rest position and a brake application position about a first pivot axis which is positionally fixed with respect to the vehicle body. A rod is coupled to the lever such that it can pivot about a second pivot axis which is moveable with respect to the vehicle body and is parallel to the first pivot axis, the rod bearing a handle element and being mounted on the vehicle body such that it can pivot about a third pivot axis, which is positionally fixed with respect to the vehicle body, and such that it can be displaced along its longitudinal direction.
    Type: Application
    Filed: February 27, 2007
    Publication date: September 13, 2007
    Inventor: Martin Otto
  • Patent number: 7224587
    Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: May 29, 2007
    Assignee: International Business Machines Corporation
    Inventors: Karl Klaus Dittus, Timothy Samuel Farrow, Walter Adrian Goodman, Dean Frederick Herring, William Fred Martin-Otto, Rodrigo Samper, John Paul Scavuzzo
  • Patent number: 7009844
    Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: March 7, 2006
    Assignee: International Business Machines Corporation
    Inventors: Timothy Samuel Farrow, Dean Frederick Herring, William Fred Martin-Otto
  • Publication number: 20050280999
    Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
    Type: Application
    Filed: June 18, 2004
    Publication date: December 22, 2005
    Applicant: International Business Machines Corp.
    Inventors: Timothy Farrow, Dean Herring, William Martin-Otto
  • Publication number: 20050281001
    Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.
    Type: Application
    Filed: June 18, 2004
    Publication date: December 22, 2005
    Applicant: International Business Machines Corp.
    Inventors: Karl Dittus, Timothy Farrow, Walter Goodman, Dean Herring, William Martin-Otto, Rodrigo Samper, John Scavuzzo
  • Patent number: 6454314
    Abstract: An elastomeric seal seals a pipe which is held in a push-in part of a plug-in coupling relative to a cylindrical interior surface of a housing of the plug-in coupling, into which the push-in part is pushed together with the pipe. The seal is in prestressed contact with the interior surface of the housing via an outward-facing annular lip and with the pipe via a radially inward-facing annular lip. The elastomeric seal is connectable by positive fitting to the push-in part, this positive fit being lockable by the assembly of the pipe to form a non-releasable connection, the pipe having a cylindrical and uninterrupted exterior circumference in the region of the seal. The joint between the seal and the push-in part is simple to assemble and is lockable by the insertion of the pipe. The connection of the seal to the push-in part may be additionally secured, with certain changes of diameter, by compression of the web-shaped connection between them.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: September 24, 2002
    Assignee: Mannesmann Sachs AG
    Inventors: Wolfgang Grosspietsch, Olaf Pagels, Martin Otto, Volker Stampf, Thomas Riess, Dieter Gebauer, Angelika Ebert