Abstract: A resin containing laminate is made, where the resin comprises the cured admixture of phenolic resin, sulfur containing lignin, and a catalytic reactant containing 50 wt. % to 100 wt. % of an alkaline-earth compound and 0 wt. % to 50 wt. % of an alkali-metal compound.

Abstract: A resin impregnated, B-staged sheet material free of crystal formations, useful for metal clad and unclad laminate production, is made by impregnating a sheet containing a resin comprising epoxy resin and an amount of curing agent effective to cure the epoxy resin to the C-stage, where the curing agent consists essentially of the reaction product of dicyandiamide and an aminophylic reagent selected from the group consisting of aldehydes, alkyl monoglycidyl ethers having the formula: ##STR1## where R=an alkyl group having from 1 to 4 carbon atoms, styrene oxide, ethylene oxide, propylene oxide, acetic anhydride, benzoyl chloride, acetyl chloride, and mixtures thereof, and then heating the impregnated sheet until the resin is in the B-stage.

Abstract: A methane diamine cured solventless liquid epoxy composition is disclosed. The composition contains an oil-modified epoxy rsin having an EEW of about 300 to 600 which is formed by reacting about 5 to about 50% of a triglyceride of a C.sub.10 to C.sub.20 fatty acid with about 50 to about 95% of an epoxy resin having at least one aliphatic hydroxyl group per molecule. The composition also contains about 0.01 to about 0.3 phr of a catalyst, up to about 80% of a glycidyl either of a phenol, about 1 equivalent, .+-.20%, of methane diamine, and about 0.2 to 3% of an accelerator.

Abstract: Electrical inductive apparatus including an electrically insulated electrical winding, an insulating dielectric surrounding the winding, and an insulating member associated with the winding which projects into the insulating dielectric. The insulating member includes a solid adhesive binder, and a filler of microspheres. The binder and microspheres are selected such that the dielectric constant of the insulating member is less than about 3.5 times the dielectric constant of the insulating dielectric.