Patents by Inventor Martin Peck

Martin Peck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060184608
    Abstract: The present invention allows a user or community of users to rate content across a variety of web sites and display contextual sensitive reviews. Rather than the rating information being controlled by the web site owner, the rating information may be owned and controlled by a third party. Users have the ability to rate a web site, review ratings from a web site, or operate a web site rating system.
    Type: Application
    Filed: February 11, 2005
    Publication date: August 17, 2006
    Applicant: Microsoft Corporation
    Inventors: Peter Williams, Mark Wilson-Thomas, Martin Peck, Robert Wilcox, Andrew Burns, Martin Grayson
  • Patent number: 6140402
    Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: October 31, 2000
    Assignee: Diemat, Inc.
    Inventors: Raymond Louis Dietz, David Martin Peck
  • Patent number: 6111005
    Abstract: Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: August 29, 2000
    Assignee: Diemat, Inc.
    Inventors: Raymond Louis Dietz, David Martin Peck