Abstract: The subject matter of this invention is a device for flexible purge management, comprising a FOUP transport system, a purging gas distribution system, one or more FOUP nests for holding FOUPs and an electronic control system. The overhead FOUP transport system, the gas distribution system and the electrical system run together for the most part. Adapter plates that serve to hold the FOUPs are arranged in the FOUP nests. A computer-supported multi-tier control system controls the device and makes it possible to individually address each FOUP nest and to also operate the remaining FOUP nests when there is partial removal.

Abstract: The subject matter of this invention is a device for flexible purge management, comprising a FOUP transport system, a purging gas distribution system, one or more purge nests for holding FOUPs and an electronic control system. The overhead FOUP transport system, the gas distribution system and the electrical system run together for the most part. Adapter plates that serve to hold the FOUPs are arranged in the FOUP nests. A computer-supported multi-tier control system controls the device and makes it possible to individually address each FOUP nest and to also operate the remaining FOUP nests when there is partial removal.

Abstract: A microscope measuring arrangement for inspecting a substrate includes a microscope, an illuminating system, preferably a sight glass, a holder, a substrate pallet and a rotary apparatus and/or tilting apparatus. The substrate pallet can be moved between at least two positions, which lie in the visual ranges respectively of the microscope and the sight glass. The substrate is first subject to an oblique light inspection for finding defect positions by the rotary and/or tilting apparatus. Without having to remove the substrate from the substrate pallet, the microscope to undertake a high-resolution inspection for classifying the defect at the defect position found.

Abstract: The present invention relates to a scribing method for wafers (11), wherein a defined beam (12) is directed onto the wafer (11) by means of a beam generator means (10) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount (31) and a beam generator means (10) by means of which at least one defined beam can be directed onto the wafer (11). The inventive method is distinguished by the by the further step of generating a first radiation pulse having a predeterminable energy density and used to create a comparatively deep pit (18) in the wafer (11). The inventive wafer scribing means is distinguished by the provision that a radiation pulse can be generated by means of which a comparatively deep pit (18) can be created in the wafer (11).

Abstract: A microscope measuring arrangement for inspecting a substrate comprises a microscope, an illuminating system, preferably a sight glass, a holder, a substrate pallet and a rotary apparatus and/or tilting apparatus. The substrate pallet can be moved between at least two positions, which lie in the visual ranges 11, 21 respectively of the microscope and the sight glass. The substrate can firstly be subjected by means of the rotary and/or tilting apparatus 71, 72 to an oblique light inspection for finding defect positions. Without having to remove the substrate from the substrate pallet, it is subsequently possible to use the microscope to undertake a high-resolution inspection for the purpose of classifying the defect at the defect position found.

Abstract: An apparatus for handling, storing and reloading carriers for disk-shaped items, such as semiconductor wafers or CDs, has at least one cleaning unit and at least one storage unit for the carriers containing the disk-shaped items. The apparatus further has at least one sorting unit for the disk-shaped items. The cleaning unit, the storage unit and the sorting apparatus are integral component parts of the apparatus and are operated by a common automatic control.

Abstract: For bay type structures of semiconductor wafer transport systems, a configuration includes interbay rail tracks and intrabay rail tracks mounted on each other, vehicles of the interbay system and carrier transfer cars of the intrabay system moving freely bi-directional inside the bay area without obstructing each other. The carrier transfer car is configured such that a wafer carrier can be directly loaded from the vehicle to the load port of a processing machine. The configuration simplifies and accelerates the transfer and enhances the flexibility of vehicles in wafer transport.

Abstract: A three-dimensional image of a semiconductor device identification pattern is obtained by measuring the distance of at least one sensor to the surface of the semiconductor device. The apparatus includes a source of radiation for deriving the distance from properties of the reflected light. A unit for determining the distance and an image processing unit are used to establish the three-dimensional picture. Positional information can be achieved in a scanning movement from motors being controlled by a control unit. By applying a threshold value, a two-dimensional image is derived and by a pattern recognition algorithm, the identification pattern can be analyzed.

Abstract: A three-dimensional image of a semiconductor device identification pattern is obtained by measuring the distance of at least one sensor to the surface of the semiconductor device. The apparatus includes a source of radiation for deriving the distance from properties of the reflected light. A means for determining the distance and an image processing unit are used to establish the three-dimensional picture. Positional information can be achieved in a scanning movement from motors being controlled by a control unit. By applying a threshold value, a two-dimensional image is derived and by a pattern recognition algorithm, the identification pattern can be analyzed.

Abstract: The present invention relates to a method and a system for operating a semiconductor factory. The factory comprises equipment (8) for processing semiconductor wafers, and an automated material handling system (12). The invention comprises clamping a wafer carrier (16) while a wafer is processed by a particular tool (10), continuing clamping the wafer carrier (16) after processing, and unclamping the wafer carrier (16) when the automated material handling system (12) is ready for removing the wafer carrier (16) from the tool (10).

Abstract: For bay type structures of semiconductor wafer transport systems, a configuration includes interbay rail tracks and intrabay rail tracks mounted on each other, vehicles of the interbay system and carrier transfer cars of the intrabay system moving freely bi-directional inside the bay area without obstructing each other. The carrier transfer car is configured such that a wafer carrier can be directly loaded from the vehicle to the load port of a processing machine. The configuration simplifies and accelerates the transfer and enhances the flexibility of vehicles in wafer transport.

Abstract: The present invention relates to a scribing method for wafers (11), wherein a defined beam (12) is directed onto the wafer (11) by means of a beam generator means (10) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount (31) and a beam generator means (10) by means of which at least one defined beam can be directed onto the wafer (11).

Abstract: An apparatus for handling, storing and reloading carriers for disk-shaped items, such as semiconductor wafers or CDs, has at least one cleaning unit and at least one storage unit for the carriers containing the disk-shaped items. The apparatus further has at least one sorting unit for the disk-shaped items. The cleaning unit, the storage unit and the sorting apparatus are integral component parts of the apparatus and are operated by a common automatic control.

Abstract: In a transportation system (100, 200) for wafers, a wafer container (100) has kinematic coupling grooves, and a support surface (200) has kinematic coupling pins. Grooves and pins are at least partially electrically conductive to allow monitoring the correct position of the container by measuring electrical resistance, as well as to allow signal exchange to and from the container (100). The kinematic coupling pins have first and second surface areas that are electrically isolated.