Abstract: A substrate processing apparatus is disclosed. The substrate processing apparatus includes: a first process unit including a plurality of first process stations configured to perform a first process in a first atmosphere; a second process unit including a plurality of second process stations configured to perform a second process in a second atmosphere different from the first atmosphere; and a transformation unit between the first process unit and the second process unit. The first process unit, the transformation unit, and the second process unit are arranged in a line. The transformation unit includes a plurality of transformation stations configured to transform an atmosphere between the first atmosphere and the second atmosphere. Thus, the efficiency of processing a substrate can be improved, and the area or length in which the substrate processing apparatus is installed can be reduced.

Abstract: A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

Abstract: A substrate processing apparatus is disclosed. The substrate processing apparatus includes: a first process unit including a plurality of first process stations configured to perform a first process in a first atmosphere; a second process unit including a plurality of second process stations configured to perform a second process in a second atmosphere different from the first atmosphere; and a transformation unit between the first process unit and the second process unit. The first process unit, the transformation unit, and the second process unit are arranged in a line. The transformation unit includes a plurality of transformation stations configured to transform an atmosphere between the first atmosphere and the second atmosphere. Thus, the efficiency of processing a substrate can be improved, and the area or length in which the substrate processing apparatus is installed can be reduced.

Abstract: A method of making an edge-sealed, encapsulated environmentally sensitive device. The method includes providing an environmentally sensitive device on a substrate; depositing a decoupling layer through one mask, the decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device; increasing the distance between the one mask and the substrate; and depositing a first barrier layer through the one mask, the first barrier layer adjacent to the decoupling layer, the first barrier layer having an area greater than the discrete area of the decoupling layer and covering the decoupling layer, the decoupling layer being sealed between the edges of the first barrier layer and the substrate or an optional second barrier layer.

Abstract: Methods of making an edge-sealed, encapsulated environmentally sensitive device. One method includes providing an environmentally sensitive device with a contact on a substrate; depositing a decoupling layer adjacent to the environmentally sensitive device, the decoupling layer having a discrete area and covering the environmentally sensitive device and not covering the contact, the decoupling layer deposited using a printing process; depositing a first barrier layer adjacent to the decoupling layer, the first barrier layer having a first area greater than the discrete area of the decoupling layer, and the first barrier layer having a second area covering the decoupling layer and the contact, the decoupling layer being sealed between the edges of the first barrier layer and the substrate or an optional second barrier layer; and removing the second area of the first barrier layer from the contact.

Abstract: A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.

Abstract: A method for manufacturing a magnetic disk comprises the step of depositing a metallic layer on a glass substrate and laser texturing the metallic layer. The magnetic disk is then completed by deposition of (a) an underlayer such as Cr or sputtered NiP, (b) a magnetic layer such as a Co or Fe alloy, and (c) a protective overcoat such as ZrO.sub.2, carbon or hydrogenated carbon. By providing the above-mentioned metallic layer, laser texturing can now be used in conjunction with glass substrates.

Abstract: A method for manufacturing a magnetic disk comprises the step of depositing a metallic layer on a glass substrate and laser texturing the metallic layer. The magnetic disk is then completed by deposition of (a) an underlayer such as Cr or sputtered NiP, (b) a magnetic layer such as a Co or Fe alloy, and (c) a protective overcoat such as ZrO.sub.2, carbon or hydrogenated carbon. By providing the above-mentioned metallic layer, laser texturing can now be used in conjunction with glass substrates.