Abstract: A method and a placement machine for equipping a carrier with components.

Abstract: A method and a placement machine for equipping a carrier with components.

Abstract: A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.

Abstract: What is described is a placement machine (100, 300, 500) for equipping a substrate (190) with unhoused chips (282). The placement machine (100, 300, 500) has (a) a chassis (112); (b) a feed device (140) for providing a wafer (180) which has a multiplicity of chips (282), wherein the feed device (140) is mounted on the chassis (112); (c) a lifting device (513), which is mounted on the chassis (112); (d) a substrate-receiving device (130) for receiving the substrate (190) to be equipped, wherein the substrate-receiving device (130) is mounted on the lifting device (513) and can be moved relative to the chassis (112) along a z-direction by means of the lifting device (513); and (e) a placement head (120) for picking up chips (282) from the provided wafer (180) and for placing the picked-up chips (282) at predefined placement positions on the received substrate (190).

Abstract: A pick and place device, a pick and place system and a method of fitting substrates with components are provided, in which feed devices having a plurality of feed modules and a corresponding plurality of collection points on opposite sides of the feed devices in each case have at least one pick and place area, pick and place heads being assigned to the pick and place areas, by way of which components can be removed alternatingly and/or simultaneously from the collection points of the feed devices in order to be positioned on substrates which are arranged in the pick and place areas.

Abstract: A method for mounting or equipping components onto substrates that utilizes a number of component mounting process areas. Each of the process areas includes a component mounting head member or equipping head for mounting the components, a number of supply units for supplying the components to the component mounting head member and a transport member for moving the components between the process areas. The method utilizes a single or a multiple stage or a combined single and multiple stage component mounting process for mounting the components, whichever is determined to be optimally utilized. The single stage process is optimally utilized for a small number of components to be mounted. The single stage process includes completely mounting the components at one of the process areas as compared to the multiple stage process which includes mounting or equipping the components at a combination of successive process areas.

Abstract: Component receptacle device (1) of an automatic placement machine for printed circuit boards (2), having at least one suction pipette (5) which serves for receiving a component (8) and interacts with an optical sensor means, wherein the optical sensor means is arranged laterally beside the suction pipette (5) in such a way that the actual position of the suction pipette (5) can be detected by way of the longitudinal profile parameters thereof, evaluation means connected downstream providing information about deviations with respect to a defined desired position of the suction pipette (5) as well as configuration information.

Abstract: The rotary positioning of a suction pipette (5) serving for receiving a component (8) takes place with the aid of an incremental encoder arrangement essentially comprising a stationary read head and a rotatable segmental disk (9) which has an incremental track (10) for measuring a traversed angle of rotation for the fine positioning and also one of two full tracks (12a, 12b) arranged in opposite quadrants (11a, 11c) of the segmental disk (9) and serving for rapid movement into an initial position of the suction pipette (5) for receiving a component (8). According to the invention, to supplement the full tracks (12a, 12b) the segmental disk (9) is in this case provided with an additional marking (13a; 13b′, 13b″; 13c) in order to ensure, by means of the incremental encoder arrangement, a reproducible angular orientation of the suction pipette (5) with respect to the initial position. (in this respect, FIG.

Abstract: In a conventional method for controlling successive machine processes, a central control unit only communicates the start commands to the individual decentralized control units when the decentralized control unit responsible for a previous machine process has communicated an end message to the central control unit. As a result of overloading the central control unit with other, a time delay arises between the individual process steps. In the method disclosed herein, the central control unit communicates a preparatory command for a second machine process to the decentralized second control unit during the execution of a first machine process together with a start condition. The second machine process is only started when the second control unit receives a completion signal directly from the first control unit to satisfy the start condition.