Patents by Inventor Martin Pugh

Martin Pugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8227527
    Abstract: A method comprising preparing a solution of clay particles solution, submitting the solution of clay particles first to a high pressure and high velocity flow for shearing the particles in the solution of clay particles, and to a sudden lower pressure, whereby the particles explode into the mist of the solution of clay particles, and mixing the finely dispersed clay solution, whereby epoxy is introduced in the solution of clay particles during on of the above steps of preparing the solution of clay particles or dispersing the solution of clay particles or to the resulting dispersed solution of clay particles, yielding an extremely fine and homogeneous distribution of the particles of nanodimensions in the epoxy, yielding a high-performance nanocomposite epoxy.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: July 24, 2012
    Assignees: Valorbec S.E.C., Conseil National de Recherches Canada
    Inventors: Van Suong Hoa, Weiping Liu, Martin Pugh, Minh-Tan Ton-That
  • Publication number: 20070299202
    Abstract: A method comprising preparing a solution of clay particles solution, submitting the solution of clay particles first to a high pressure and high velocity flow for shearing the particles in the solution of clay particles, and to a sudden lower pressure, whereby the particles explode into the mist of the solution of clay particles, and mixing the finely dispersed clay solution, whereby epoxy is introduced in the solution of clay particles during on of the above steps of preparing the solution of clay particles or dispersing the solution of clay particles or to the resulting dispersed solution of clay particles, yielding an extremely fine and homogeneous distribution of the particles of nanodimensions in the epoxy, yielding a high-performance nanocomposite epoxy.
    Type: Application
    Filed: December 22, 2004
    Publication date: December 27, 2007
    Applicants: Concordia University, Valorbec S.E.C., Conseil National De Recherches Canada
    Inventors: Van Hoa, Weiping Liu, Martin Pugh, Minh-Tan Ton-That