Abstract: A plurality of component lead processing assemblies are located in a plane each releasably secured to a different given location on a support structure. Each processing assembly has an anvil and a lead processing part which is rotatable relative to the anvil for performing the lead processing on leads of components secured to a printed circuit board. A link structure is coupled to each lead processing part movable in a direction parallel to the plane of the processing assemblies for concurrently rotating the processing parts in response to the actuation of drive means.

Abstract: A lead cutting and clinching device includes a housing to which an air cylinder and a cylindrical anvil are secured. A lead cutting and clinching element driven by the air cylinder is rotatably mounted to the anvil and has a cylindrical outer peripheral edge coextensive with the anvil outer surface. A portion of the outer peripheral surface of the lead cutting and clinching element, outer surface of the anvil, and the outer peripheral surface of the housing, in the same angular radial segment having its origin at the axis of rotation of the clinching element are substantially coextensive in a direction parallel to the axis of rotation of the clinching element. An array of these component lead processing devices may be formed with the circular surfaces in the radial segments contiguous with each other to closely space the lead cutting and clinching elements of the array.

Abstract: The leads of an IC module are bent to secure the module to a printed circuit board by a pair of rotatable bending members driven concurrently by a camming member which rotates about an axis normal to the axes of rotation of the bending members. Cam follower projections from the bending members engage spiral cam slots in the camming member. The slots spiral away from the axis of rotation of the camming member. All of the above structures are beneath the circuit board and above the lap of an operator who places the module on the board from above the board.

Abstract: This invention pertains to increasing the arc track resistance of printed circuit boards by applying an acrylic resin to the printed circuit board wherein the acrylic resin is a polymer having the recurring unit: ##STR1## wherein x of each unit is independently selected from integers of 0 to 15 and each R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 is independently selected from the group consisting of H, --CH.sub.3 and --C.sub.2 H.sub.5.

Abstract: An ion current is produced between two spatially separated electrodes by creating a corona discharge about one of these electrodes and causing ions to flow to the other electrode. Aerosols introduced into the region between the two electrodes interact with the flowing ions causing a resultant decrease in ion current. A decrease in ion current is sensed to indicate the presence of aerosols.

Abstract: An ion current is produced between two spatially separated electrodes by creating a corona discharge about one of these electrodes and causing ions to flow to the other electrode. Aerosols introduced into the region between the two electrodes interact with the flowing ions causing a resultant decrease in ion current. A decrease in ion current is sensed to indicate the presence of aerosols. A reflecting member reflects aerosols towards the electrodes causing a relatively lengthy interaction between the aerosols and the ion current.