Abstract: This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

Abstract: This disclosure is directed to methods for preparing thermoplastic surfaces suitable for the application of paint, adhesives, or surfacing films and the structures derived or derivable from these methods. The disclosure is also directed to composite structures comprising a thermoplastic substrate comprising a chemical sealant direct bonded to a surface thereof, the chemical sealant providing a surface suitable for adhering adhesives, paints, and/or surfacing films to the thermoplastic surfaces.

Abstract: The present disclosure provides two part, room-temperature curable hybrid epoxy/(meth)acrylate compositions, comprising: (a) a first component, comprising (meth)acrylate monomers, crosslinkers, epoxy curatives, and optional free radical accelerator, tougheners, fillers and additives, and inhibitors; and (b) a second component, comprising epoxy resins, methacrylate free radical initiators, and optional tougheners, fillers and additives. The compositions provide among other advantageous properties fast cure rate, extremely high compression properties, and good thermal cycling performance.

Abstract: A fiber composite material obtainable by (a) mixing the components of a multi-component agent immediately before use, wherein component A of the multi-component agent contains at least one compound having two or more isocyanate groups, component B of the multi-component agent contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, and at least one of the components of the multi-component agent contains at least one epoxide prepolymer, (b) introducing the resulting application preparation into a mold in which fibers and optionally further additives are present, the resulting mixture containing at least one latent hardener for epoxide prepolymers, (c) pre-curing the resulting mixture at a temperature from 5° C. to 90° C., and (d) then finally curing the pre-cured fiber composite material at temperatures from 100° C. to 240° C.

Abstract: The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Abstract: The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

Abstract: A two-component premix for preparing a heat-expandable and heat-curable epoxy-based material, comprises an isocyanate, a diol or polyol, an epoxy prepolymer, a heat-activatable hardener for epoxy prepolymers, and a heat-activatable blowing agent.

Abstract: The present invention relates to a method for forming a welded bond between polymer surfaces, comprising (i) applying a welding promoter composition to a to-be-welded area of one or both polymer surface(s), wherein the welding promoter composition comprises particles with a particle size range of 0.1 to 1000 ?m, the particles being made of a material that is inert towards a chemical reaction with the first and/or second polymer surface; (ii) applying energy to the to-be-welded area of the first polymer surface, the second polymer surface or both, the energy being sufficient to melt at least a portion of the polymer in the to-be-welded area of the polymer surface, and contacting the to-be-welded areas of the polymer surfaces; and (iii) allowing the molten polymer in the to-be-welded area to solidify so that a welded bond is formed between the polymer surfaces. The invention further relates to the thus produced articles and the use of the described compositions as welding promoters.

Abstract: Provided herein are electronic devices assembled with thermally insulating layers.

Abstract: The subject matter of the present application is a thermally expandable preparation that can be pumped at application temperatures below 70° C., containing (a) at least one first epoxy resin E1 that has an epoxy equivalent weight of at most 280 g/eq and a viscosity of at most 1250 Pa*s at 25° C., (b) at least one second epoxy resin E2 that has an epoxy equivalent weight of at least 300 g/eq and a viscosity of at most 250 Pa*s at 25° C., (c) at least one hardener that can be thermally activated, (d) at least one propellant that can be thermally activated, and (e) at least 1 wt. % of organic fibres having a fibre length of 0.2 mm to 10 mm.

Abstract: Provided herein are electronic devices assembled with thermally insulating layers.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

Abstract: A fiber composite material obtainable by (a) mixing the components of a multi-component agent immediately before use, wherein component A of the multi-component agent contains at least one compound having two or more isocyanate groups, component B of the multi-component agent contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, and at least one of the components of the multi-component agent contains at least one epoxide prepolymer, (b) introducing the resulting application preparation into a mold in which fibers and optionally further additives are present, the resulting mixture containing at least one latent hardener for epoxide prepolymers, (c) pre-curing the resulting mixture at a temperature from 5° C. to 90° C., and (d) then finally curing the pre-cured fiber composite material at temperatures from 100° C. to 240° C.

Abstract: A two-component premix for preparing a heat-expandable and heat-curable epoxy-based material, comprises an isocyanate, a diol or polyol, an epoxy prepolymer, a heat-activatable hardener for epoxy prepolymers, and a heat-activatable blowing agent.

Abstract: A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate.

Abstract: A thermally curable adhesive in strip or film form, having a thickness in the range of 0.1 to 5 mm, containing: a) at least one reactive epoxy prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers that are selected from: c1) thermoplastic polyurethanes, c2) thermoplastic isocyanates, and c3) block copolymers having thermoplastic polymer blocks. Further components can additionally be contained, for example a blowing agent for foaming. The adhesive in the uncured state at 22° C. is bendable or wrappable and can be extended at least 100% before tearing. It can be laid onto a foil. It can be used, for example, for adhesive bonding of planar, tubular, or cylindrical components, preferably components made of metal, wood, ceramic, or ferrites.

Abstract: Disclosed is a thermally expandable and curable material containing: a) at least one epoxide prepolymer; b) at least one heat-activated curing agent for the prepolymer; c) at least one foaming agent; and d) at least one thermoplastic, non-reactive polyurethane selected from among polyurethanes containing a polyester chain. Also disclosed are the use of such a material for stiffening or reinforcing components as well as an extruded or injection-molded article made of such a material.

Abstract: A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard reduction potential E0M more positive than the standard reduction potential of the surface of the metal substrate; an object comprising a metal substrate and a non-halogenated polymer bonded together by this process; a tube or pipe made of a metal substrate onto which a layer of a non-halogenated polymer is bonded by a cured epoxy-based adhesive.