Patents by Inventor Martin Richard Niessner

Martin Richard Niessner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10916484
    Abstract: An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: February 9, 2021
    Assignee: Infineon Technologies AG
    Inventors: Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner, Thorsten Meyer, Martin Richard Niessner, Maciej Wojnowski
  • Publication number: 20200321295
    Abstract: A semiconductor device comprises a semiconductor chip having a radio-frequency circuit and a radio-frequency terminal, an external radio-frequency terminal, and a non-galvanic connection arranged between the radio-frequency terminal of the semiconductor chip and the external radio-frequency terminal, wherein the non-galvanic connection is designed to transmit a radio-frequency signal.
    Type: Application
    Filed: April 6, 2020
    Publication date: October 8, 2020
    Inventors: Walter HARTNER, Francesca ARCIONI, Birgit HEBLER, Martin Richard NIESSNER, Claus WAECHTER, Maciej WOJNOWSKI
  • Patent number: 10607911
    Abstract: A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: March 31, 2020
    Assignee: Infineon Technologies AG
    Inventors: Martin Richard Niessner, Walter Hartner, Gerhard Haubner, Sebastian Pahlke
  • Patent number: 10408919
    Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: September 10, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Ashutosh Baheti, Ismail Nasr, Ngoc-Hoa Huynh, Martin Richard Niessner
  • Publication number: 20190198455
    Abstract: A semiconductor apparatus comprises: a circuit board; a semiconductor package having a main surface, wherein the semiconductor package is arranged on the circuit board and the main surface faces the circuit board; a radio-frequency line element of the semiconductor package, which radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is designed to transmit a signal at a frequency of greater than 10 GHz; and an underfiller material arranged between the circuit board and the semiconductor package, wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Inventors: Walter HARTNER, Christian GEISSLER, Thomas KILGER, Johannes LODERMEYER, Franz-Xaver MUEHLBAUER, Martin Richard NIESSNER, Claus WAECHTER
  • Patent number: 10317512
    Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: June 11, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Saverio Trotta, Ashutosh Baheti, Ismail Nasr, Ngoc-Hoa Huynh, Martin Richard Niessner
  • Publication number: 20190113601
    Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 18, 2019
    Inventors: Saverio Trotta, Ashutosh Baheti, Ismail Nasr, Ngoc-Hoa Huynh, Martin Richard Niessner
  • Publication number: 20180374769
    Abstract: An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution layer (RDL) comprising an RDL pad connected with the solder ball. The RDL pad including at least one void, the void being disposed at least in partial in an area of the RDL pad laterally outside of the opening of the dielectric layer.
    Type: Application
    Filed: June 21, 2018
    Publication date: December 27, 2018
    Applicant: Infineon Technologies AG
    Inventors: Robert Fehler, Francesca Arcioni, Christian Geissler, Walter Hartner, Gerhard Haubner, Thorsten Meyer, Martin Richard Niessner, Maciej Wojnowski
  • Publication number: 20160211189
    Abstract: A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.
    Type: Application
    Filed: January 18, 2016
    Publication date: July 21, 2016
    Inventors: Martin Richard NIESSNER, Walter HARTNER, Gerhard HAUBNER, Sebastian PAHLKE
  • Publication number: 20160178730
    Abstract: In accordance with an embodiment, a packaged radio frequency (RF) circuit includes a radio frequency integrated circuit (RFIC) disposed on a substrate that has plurality of receiver circuits coupled to receive ports at a first edge of the RFIC, and a first transmit circuit coupled to a first transmit port at a second edge of the RFIC. The packaged RF circuit also includes a receive antenna system disposed on the package substrate adjacent to the first edge of the RFIC and a first transmit antenna disposed on the package substrate adjacent to the second edge of the RFIC and electrically coupled to the first transmit port of the RFIC. The receive antenna system includes a plurality of receive antenna elements that are each electrically coupled to a corresponding receive port.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 23, 2016
    Inventors: Saverio Trotta, Ashutosh Baheti, Ismail Nasr, Ngoc-Hoa Huynh, Martin Richard Niessner