Patents by Inventor Martin Risthaus

Martin Risthaus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11078390
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 3, 2021
    Assignees: Evonik Operations GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • Patent number: 10603872
    Abstract: The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 31, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Maximilian Gruhn, Karl Kuhmann, Martin Risthaus
  • Publication number: 20190185724
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Applicants: Evonik Degussa GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • Patent number: 10273390
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: April 30, 2019
    Assignees: Evonik Degussa GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • Patent number: 10246575
    Abstract: The invention relates to a polymer composition, and to a semifinished plastics product, the surface of which has been formed at least to some extent from the polymer composition. The invention further relates to a production process associated therewith for the semifinished plastics product. A feature of the polymer composition is that it comprises from 50 to 99.7% by weight of a polymer and from 0.3 to 20% by weight of one or more adhesion-promoting additives. The invention further relates to plastics-metal hybrid components and production of these.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: April 2, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Karl Kuhmann, Maximilian Gruhn, Olivier Farges, Martin Risthaus, Kathrin Lehmann
  • Publication number: 20170121503
    Abstract: The invention relates to a polymer composition, and to a semifinished plastics product, the surface of which has been formed at least to some extent from the polymer composition. The invention further relates to a production process associated therewith for the semifinished plastics product. A feature of the polymer composition is that it comprises from 50 to 99.7% by weight of a polymer and from 0.3 to 20% by weight of one or more adhesion-promoting additives. The invention further relates to plastics-metal hybrid components and production of these.
    Type: Application
    Filed: March 31, 2015
    Publication date: May 4, 2017
    Applicant: Evonik Degussa GmbH
    Inventors: Karl KUHMANN, Maximilian GRUHN, Olivier FARGES, Martin RISTHAUS, Kathrin LEHMANN
  • Patent number: 9574700
    Abstract: A pipeline laid trenchlessly and/or without a sand bed is produced using a metallic conduit which is encased with an extruded layer of a polyamide molding material. In this way, the durability of the outer shell required for trenchless laying techniques without a sand bed is ensured.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: February 21, 2017
    Assignees: Evonik Degussa GmbH, Salzgitter Mannesmann Line Pipe GmbH
    Inventors: Andreas Dowe, Rainer Goering, Martin Risthaus, Klaus Gahlmann, Reinhard Buessing, Hans-Juergen Kocks, Joern Winkels
  • Publication number: 20150375478
    Abstract: The invention relates to hybrid components comprising at least one fibre composite material as material B and at least one material A. Material A is selected from plastics, metals, ceramic compositions, wood, glass, composite materials, textile fibres and from prefabricated products produced from textile fibres. Material A is bonded to material B by at least one coating of an adhesion promoter composition comprising at least one copolyamide-based hotmelt adhesive.
    Type: Application
    Filed: January 29, 2014
    Publication date: December 31, 2015
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Maximilian GRUHN, Karl KUHMANN, Martin RISTHAUS
  • Publication number: 20150361316
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Application
    Filed: January 29, 2014
    Publication date: December 17, 2015
    Applicants: Evonik Degussa GmbH, SI-Coating GmbH
    Inventors: Willi HENKENJOHANN, Karl KUHMANN, Maximilian GRUHN, Andreas PAWLIK, Martin RISTHAUS, Klaus WELSCH, Sven MANG
  • Publication number: 20150361304
    Abstract: The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.
    Type: Application
    Filed: January 29, 2014
    Publication date: December 17, 2015
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Maximilian GRUHN, Karl KUHMANN, Martin RISTHAUS
  • Patent number: 9205630
    Abstract: A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: December 8, 2015
    Assignee: Evonik Degussa GmbH
    Inventors: Andreas Pawlik, Martin Risthaus, Jochen Fritz
  • Publication number: 20150282566
    Abstract: The invention relates to studded shoes which comprise metal studs and a plastics sole. Studs and sole are connected to one another by a coating of an adhesion promoter composition, wherein the composition comprises at least one copolyamide-based hot-melt adhesive. The studded shoe can be used in the sports sector or hiking sector.
    Type: Application
    Filed: July 10, 2014
    Publication date: October 8, 2015
    Applicant: EVONIK INDUSTRIES AG
    Inventors: Maximilian Gruhn, Klaus Huelsmann, Karl Kuhmann, Michael Beyer, Martin Risthaus, Jun Shi
  • Patent number: 8449641
    Abstract: A process for producing a regenerable ceramic particulate filter for diesel vehicles is described, wherein a material comprising silicon-containing particles is pyrolyzed in the presence of a polyamide. The resulting particulate filters have a BET surface area of >350 m2/l.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: May 28, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Martin Risthaus, Hans-Joachim Wönicker
  • Patent number: 8153269
    Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: April 10, 2012
    Assignee: Evonik Degussa GmbH
    Inventors: Martin Risthaus, Hans-Joachim Woenicker
  • Publication number: 20120070670
    Abstract: A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.
    Type: Application
    Filed: March 31, 2010
    Publication date: March 22, 2012
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Andreas Pawlik, Martin Risthaus, Jochen Fritz
  • Publication number: 20110143142
    Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
    Type: Application
    Filed: February 28, 2011
    Publication date: June 16, 2011
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Martin Risthaus, Hans-Joachim Wönicker
  • Patent number: 7951260
    Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: May 31, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Martin Risthaus, Hans-Joachim Wönicker
  • Publication number: 20100300572
    Abstract: A pipeline laid trenchlessly and/or without a sand bed is produced using a metallic conduit which is encased with an extruded layer of a polyamide moulding material. In this way, the durability of the outer shell required for trenchless laying techniques without a sand bed is ensured.
    Type: Application
    Filed: August 27, 2008
    Publication date: December 2, 2010
    Applicants: Evonik Degussa GMBH, Salzgitter Mannesmann Line Pipe GMBH
    Inventors: Andreas Dowe, Rainer Goering, Martin Risthaus, Klaus Gahlmann, Reinhard Buessing, Hans-Juergen Kocks, Joern Winkels
  • Publication number: 20090255402
    Abstract: A process for producing a regenerable ceramic particulate filter for diesel vehicles is described, wherein a material comprising silicon-containing particles is pyrolyzed in the presence of a polyamide. The resulting particulate filters have a BET surface area of >350 m2/l.
    Type: Application
    Filed: April 13, 2009
    Publication date: October 15, 2009
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Martin Risthaus, Hans-Joachim Woenicker
  • Publication number: 20070163709
    Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
    Type: Application
    Filed: January 17, 2007
    Publication date: July 19, 2007
    Applicant: DEGUSSA AG
    Inventors: Martin RISTHAUS, Hans-Joachim Wonicker