Patents by Inventor Martin ROEVER

Martin ROEVER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device structure and method of manufacture
    Patent number: 10720498
    Abstract: This disclosure relates to a semiconductor device structure and method of manufacturing a semiconductor device. The semiconductor device structure comprises a semiconductor substrate having an edge region laterally separated from a device region; an edge termination structure arranged on the semiconductor substrate; wherein the edge termination structure comprises: a first oxide layer arranged on the substrate to extend from the active region to the edge region; an isolation layer arranged on top of the first oxide layer; and a metal layer arranged to at least partially cover the isolation layer and wherein the metal layer is further arranged to extend from the isolation layer to contact the edge region.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: July 21, 2020
    Assignee: Nexperia B.V.
    Inventors: Martin Roever, Soenke Habenicht, Stefan Berglund, Seong-Woo Bae
  • SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURE
    Publication number: 20190165111
    Abstract: This disclosure relates to a semiconductor device structure and method of manufacturing a semiconductor device. The semiconductor device structure comprises a semiconductor substrate having an edge region laterally separated from a device region; an edge termination structure arranged on the semiconductor substrate; wherein the edge termination structure comprises: a first oxide layer arranged on the substrate to extend from the active region to the edge region; an isolation layer arranged on top of the first oxide layer; and a metal layer arranged to at least partially cover the isolation layer and wherein the metal layer is further arranged to extend from the isolation layer to contact the edge region.
    Type: Application
    Filed: November 20, 2018
    Publication date: May 30, 2019
    Applicant: NEXPERIA B.V.
    Inventors: Martin ROEVER, Soenke HABENICHT, Stefan BERGLUND, Seong-Woo BAE