Patents by Inventor Martin S. Leung

Martin S. Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8244066
    Abstract: A system and method determines the shape of a surface that preferably is a deployed space-based adaptive flexible membrane antenna, using patterned projections, image capturing, and membrane shape processing for producing membrane shape data describing the contour of the surface of the membrane with the membrane shape data then preferably used as inputs for a feedback control actuation system for deforming the membrane to a desired shaped so as to maintain the three-dimensional shape of the membrane in the desired shape.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: August 14, 2012
    Assignee: The Aerospace Corporation
    Inventors: Neil A. Ives, Chia-Hsin Suen, Martin S. Leung, Nicholas J. Marechal, Ivan Bekey, David C. Straw, Maribeth Mason
  • Publication number: 20090238470
    Abstract: A system and method determines the shape of a surface that preferably is a deployed space-based adaptive flexible membrane antenna, using patterned projections, image capturing, and membrane shape processing for producing membrane shape data describing the contour of the surface of the membrane with the membrane shape data then preferably used as inputs for a feedback control actuation system for deforming the membrane to a desired shaped so as to maintain the three-dimensional shape of the membrane in the desired shape.
    Type: Application
    Filed: March 24, 2008
    Publication date: September 24, 2009
    Inventors: Neil A. Ives, Chia-Hsin Suen, Martin S. Leung, Nicholas J. Marechal, Ivan Bekey, David C. Straw, Maribeth Mason
  • Patent number: 6440637
    Abstract: A process for forming a nanocrystal nanostructure is repeated for growing the nanostructure disposed on an electron beam resist layer that is disposed on a substrate for forming an electron beam shadowmask from the nanostructure on the electron beam resist layer prior to electron beam exposure for patterning the electron beam resist layer in advance of subsequent processing steps. The nanocrystals are semiconductor materials and metals such as silver. The nanostructure enable the creation of ultra-fine nanometer sized electron beam patterned structures for use in the manufacture of submicron devices such as submicron-sized semiconductors and microelectromechanical devices.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: August 27, 2002
    Assignee: The Aerospace Corporation
    Inventors: Sung H. Choi, Martin S. Leung, Gary W. Stupian, Nathan Presser
  • Patent number: 5745197
    Abstract: A system for achieving a three-dimensional (3D) volumetric display by using a successive stack of transparent two-dimensional planar layers each having light-absorbing elements representing contours as dark features associated with individual respective slices through a three-dimensional object in a direction perpendicular to the plane of view of each of the planar layers so that the combined assembled volumetric display when viewed achieves a volumetric display which may be reconfigured using physical, chemical, electronic and computer-assisted means, so as to effect a dynamic volumetric display.
    Type: Grant
    Filed: October 20, 1995
    Date of Patent: April 28, 1998
    Assignee: The Aerospace Corporation
    Inventors: Martin S. Leung, Neil A. Ives, Genghmun Eng
  • Patent number: 5543364
    Abstract: A hydrogen out venting window is disposed on or in a hermetically sealed electronic package lid, the window including a catalyst which dissociates internally trapped molecular hydrogen at an interior surface of the catalyst into atomic hydrogen and which recombines the atomic hydrogen back into molecular hydrogen at an exterior surface of the catalyst with the atomic hydrogen diffusing from the interior surface to the exterior surface to vent out the molecular hydrogen from the interior of the package to the exterior of the package, the window taking various forms including a catalyst sandwich with the package lid disposed between an interior catalysis plate and an exterior catalysis plate, a plate window with a catalysis covering plate disposed over a hole in the package lid, a plug window having a catalysis plug disposed in a hole in the package lid, or a lid window where the package lid is the catalyst, the catalyst being a suitable transition metal such as palladium or platinum, or alloy, disposed on or i
    Type: Grant
    Filed: December 20, 1994
    Date of Patent: August 6, 1996
    Assignee: The Aerospace Corporation
    Inventors: Gary W. Stupian, Martin S. Leung
  • Patent number: 5491361
    Abstract: A hydrogen out venting window is disposed on or in a hermetically sealed electronic package lid, the window including a catalyst which dissociates internally trapped molecular hydrogen at an interior surface of the catalyst into atomic hydrogen and which recombines the atomic hydrogen back into molecular hydrogen at an exterior surface of the catalyst with the atomic hydrogen diffusing from the interior surface to the exterior surface to vent out the molecular hydrogen from the interior of the package to the exterior of the package, the window taking various forms including a catalyst sandwich with the package lid disposed between an interior catalysis plate and an exterior catalysis plate, a plate window with a catalysis covering plate disposed over a hole in the package lid, a plug window having a catalysis plug disposed in a hole in the package lid, or a lid window where the package lid is the catalyst, the catalyst being a suitable transition metal such as pallidium or platinum, or alloy, disposed on or i
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: February 13, 1996
    Assignee: The Aerospace Corporation
    Inventors: Gary W. Stupian, Martin S. Leung
  • Patent number: 4734151
    Abstract: The present invention discloses a non-contact technique of polishing semiconductor materials using an apparatus that produces a laminar flow of a polishing solution across the surface of the material to be polished.
    Type: Grant
    Filed: February 6, 1987
    Date of Patent: March 29, 1988
    Assignee: The Aerospace Corporation
    Inventors: Neil A. Ives, Martin S. Leung
  • Patent number: 4385136
    Abstract: A reinforced, filled thermoplastic polymer composition, having increased strength and ductility, contains a reinforcement promoter having at least two reactive olefinic double bonds and a positive promoter index, based on the double bond resonance and polarity, and the promoter adsorptivity.
    Type: Grant
    Filed: August 27, 1981
    Date of Patent: May 24, 1983
    Assignee: Union Carbide Corporation
    Inventors: Fred H. Ancker, Arnold C. Ashcraft, Jr., Martin S. Leung, Audrey Y. Ku
  • Patent number: RE31992
    Abstract: A reinforced, filled thermoplastic polymer composition, having increased strength and ductility, contains a reinforcement promoter having at least two reactive olefinic double bonds and a positive promoter index, based on the double bond resonance and polarity, and the promoter adsorptivity.
    Type: Grant
    Filed: November 29, 1983
    Date of Patent: September 24, 1985
    Assignee: Union Carbide Corporation
    Inventors: Fred H. Ancker, Arnold C. Ashcraft, Jr., Martin S. Leung, Audrey Y. Ku