Patents by Inventor Martin Scales

Martin Scales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6592439
    Abstract: Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: July 15, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Shijian Li, Manoocher Birang, Ramin Emami, Andrew Nagengast, Douglas Orcutt Brown, Shi-Ping Wang, Martin Scales, John White
  • Patent number: 6520841
    Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen by a fixed distance each time the polishing sheet is incremented. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: February 18, 2003
    Assignees: Applied Materials, Inc., Micron Technology, Inc.
    Inventors: Manoocher Birang, Martin Scales, Karl M. Robinson
  • Patent number: 6413873
    Abstract: A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.
    Type: Grant
    Filed: May 3, 2000
    Date of Patent: July 2, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Shijian Li, John M. White, Lawrence M. Rosenberg, Martin Scales, Ramin Emami, James V. Tietz, Manoocher Birang
  • Publication number: 20020052171
    Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen by a fixed distance each time the polishing sheet is incremented. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.
    Type: Application
    Filed: July 6, 2001
    Publication date: May 2, 2002
    Inventors: Manoocher Birang, Martin Scales, Karl M. Robinson