Patents by Inventor Martin Schrems

Martin Schrems has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11313749
    Abstract: In an embodiment a pressure sensor device includes a substrate body, a pressure sensor having a membrane and a cap body having at least one opening, wherein the pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, and wherein the mass of the substrate body amounts to at least 80% of the mass of the cap body and at most 120% of the mass of the cap body.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: April 26, 2022
    Assignee: SCIOSENSE B.V.
    Inventors: Joerg Siegert, Willem Frederik Adrianus Besling, Coenraad Cornelis Tak, Martin Schrems, Franz Schrank
  • Patent number: 11271134
    Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: March 8, 2022
    Assignee: AMS AG
    Inventors: Gregor Toschkoff, Thomas Bodner, Franz Schrank, Miklos Labodi, Joerg Siegert, Martin Schrems
  • Patent number: 11201119
    Abstract: A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: December 14, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Martin Schrems, Erich Schlaffer, Steve Anderson
  • Publication number: 20210084747
    Abstract: An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.
    Type: Application
    Filed: September 12, 2019
    Publication date: March 18, 2021
    Inventors: Martin Schrems, Markus Leitgeb, Steve Anderson
  • Publication number: 20200313031
    Abstract: A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench.
    Type: Application
    Filed: October 15, 2018
    Publication date: October 1, 2020
    Inventors: Gregor TOSCHKOFF, Thomas BODNER, Franz SCHRANK, Miklos LABODI, Joerg SIEGERT, Martin SCHREMS
  • Patent number: 10790234
    Abstract: A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: September 29, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Marco Gavagnin, Markus Leitgeb, Martin Schrems, Roland Winkler, Steve Anderson
  • Publication number: 20190378801
    Abstract: A component carrier including i) an electronic component embedded in the component carrier, ii) an antenna structure arranged at a region of a first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure and the electronic component. Hereby, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier includes an electrically conductive structure to electrically connect the electronic component and the antenna structure through the shielding structure. The shielding structure is non-perforated at least in a plane between the antenna structure and the electronic component.
    Type: Application
    Filed: June 6, 2018
    Publication date: December 12, 2019
    Inventors: Markus Leitgeb, Martin Schrems, Erich Schlaffer, Steve Anderson
  • Publication number: 20190312076
    Abstract: The system-on-chip camera comprises a semiconductor body (1) with an integrated circuit (40), a sensor substrate (2), sensor elements (3) arranged in the sensor substrate according to an array of pixels, a light sensor (4) in the sensor substrate apart from the sensor elements, and a lens or an array of lenses (15) on a surface of incidence (30). Filter elements (11, 12, 13), which may especially be interference filters for red, green or blue, are arranged between the sensor elements and the surface of incidence.
    Type: Application
    Filed: June 13, 2017
    Publication date: October 10, 2019
    Inventors: Martin SCHREMS, Thomas STOCKMEIER
  • Publication number: 20190265119
    Abstract: A pressure sensor device comprises a substrate body, a pressure sensor comprising a membrane, and a cap body comprising at least one opening. The pressure sensor is arranged between the substrate body and the cap body in a vertical direction which is perpendicular to the main plane of extension of the substrate body, and the mass of the substrate body equals approximately the mass of the cap body. Furthermore, a method for forming a pressure sensor device is provided.
    Type: Application
    Filed: October 2, 2017
    Publication date: August 29, 2019
    Inventors: Joerg Siegert, Willem Frederik Adrianus Besling, Coenraad Cornelis Tak, Martin SCHREMS, FRANZ SCHRANK
  • Patent number: 10374114
    Abstract: The lateral single-photon avalanche diode comprises a semiconductor body comprising a semiconductor material of a first type of electric conductivity, a trench in the semiconductor body, and anode and cathode terminals. A junction region of the first type of electric conductivity is located near the sidewall of the trench, and the electric conductivity is higher in the junction region than at a farther distance from the sidewall. A semiconductor layer of an opposite second type of electric conductivity is arranged at the sidewall of the trench adjacent to the junction region. The anode and cathode terminals are electrically connected with the semiconductor layer and with the junction region, respectively. The junction region may be formed by a sidewall implantation.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: August 6, 2019
    Assignee: ams AG
    Inventors: Jordi Teva, Frederic Roger, Ewald Stueckler, Stefan Jessenig, Rainer Minixhofer, Ewald Wachmann, Martin Schrems, Guenther Koppitsch
  • Publication number: 20190237500
    Abstract: A 3D-Integrated optical sensor comprises a semiconductor substrate, an integrated circuit, a wiring, a filter layer, a transparent spacer layer, and an on-chip diffuser. The semiconductor substrate has a main surface. The integrated circuit comprises at least one light sensitive area and is arranged in the substrate at or near the main surface. The wiring provides an electrical connection to the integrated circuit and is connected to the integrated circuit. The wiring is arranged on or in the semiconductor substrate. The filter layer has a direction dependent transmission characteristic and is arranged on the integrated circuit. In fact, the filter layer at least covers the light sensitive area. The transparent spacer layer is arranged on the main surface and, at least partly, encloses the filter layer. A spacer thickness is arranged to limit a spectral shift of the filter layer. The on-chip diffuser is arranged on the transparent spacer layer.
    Type: Application
    Filed: June 2, 2017
    Publication date: August 1, 2019
    Inventors: Hubert Enichlmair, Martin SCHREMS, Gregor Toschkoff, Thomas Bodner, Mario Manninger
  • Patent number: 10340254
    Abstract: The method of producing an interposer-chip-arrangement, comprises providing an interposer (1) with an integrated circuit (25), arranging a dielectric layer (2) with metal layers embedded in the dielectric layer above a main surface (10) of the interposer, connecting the integrated circuit with at least one of the metal layers, forming an interconnection (7) through the interposer, the interconnection contacting one of the metal layers, arranging a further dielectric layer (3) above a further main surface (11) of the interposer opposite the main surface and arranging a further metal layer in or on the further dielectric layer, the further metal layer being connected with the interconnection, arranging a chip provided with at least one contact pad at the main surface or at the further main surface, and electrically conductively connecting the contact pad with the interconnection.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: July 2, 2019
    Assignee: ams AG
    Inventors: Jochen Kraft, Martin Schrems, Franz Schrank
  • Publication number: 20190148304
    Abstract: A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 16, 2019
    Inventors: Marco Gavagnin, Markus Leitgeb, Martin Schrems, Roland Winkler, Steve Anderson
  • Patent number: 10283541
    Abstract: A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: May 7, 2019
    Assignee: ams AG
    Inventors: Joerg Siegert, Franz Schrank, Martin Schrems
  • Patent number: 10256147
    Abstract: The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: April 9, 2019
    Assignee: ams AG
    Inventors: Martin Schrems, Bernhard Stering, Franz Schrank
  • Patent number: 10217715
    Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15?) of the cavity is provided to expose the cavity to the environment.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: February 26, 2019
    Assignee: ams AG
    Inventors: Martin Schrems, Bernhard Stering, Harald Etschmaier
  • Patent number: 9947711
    Abstract: The semiconductor device comprises a semiconductor substrate (1), a sensor or sensor array (2) arranged at a main surface (10) of the substrate, an integrated circuit (3) arranged at or above the main surface, and a focusing element (17) comprising recesses (4) formed within a further main surface (11) of the substrate opposite the main surface. The focusing element may be arranged opposite the sensor or sensor array (2), which may be a photosensor or photodetector or an array of photosensors or photodetectors, for instance. The focusing element (17) is formed by etching the recesses (4) into the semiconductor material.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: April 17, 2018
    Assignee: AMS AG
    Inventors: Rainer Minixhofer, Martin Schrems, Sara Carniello
  • Publication number: 20180096969
    Abstract: The method of producing an interposer-chip-arrangement, comprises providing an interposer (1) with an integrated circuit (25), arranging a dielectric layer (2) with metal layers embedded in the dielectric layer above a main surface (10) of the interposer, connecting the integrated circuit with at least one of the metal layers, forming an interconnection (7) through the interposer, the interconnection contacting one of the metal layers, arranging a further dielectric layer (3) above a further main surface (11) of the interposer opposite the main surface and arranging a further metal layer in or on the further dielectric layer, the further metal layer being connected with the interconnection, arranging a chip provided with at least one contact pad at the main surface or at the further main surface, and electrically conductively connecting the contact pad with the interconnection.
    Type: Application
    Filed: October 6, 2017
    Publication date: April 5, 2018
    Inventors: Jochen KRAFT, Martin SCHREMS, Franz SCHRANK
  • Patent number: 9929035
    Abstract: A relief structure is formed on a surface of a carrier provided for accommodating a wafer, which is fastened to the carrier by a removable adhesive contacting the carrier. The relief structure, which may be spatially confined to the center of the carrier, reduces the strength of adhesion between the wafer and the carrier. If the adhesive is appropriately selected and maintains the connection between the wafer and the carrier at elevated temperatures, further process steps can be performed at temperatures of typically 300° C. or more. The subsequent mechanical separation of the adhesive joint is facilitated by the relief structure on the carrier.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: March 27, 2018
    Assignee: ams AG
    Inventors: Thomas Bodner, Joerg Siegert, Martin Schrems
  • Patent number: 9870988
    Abstract: A semiconductor substrate is provided with an annular cavity extending from a front side of the substrate to an opposite rear side. A metallization is applied in the annular cavity, thereby forming a through-substrate via and leaving an opening of the annular cavity at the front side. A solder ball is placed above the opening and a reflow of the solder ball is effected, thereby forming a void of the through-substrate via, the void being covered by the solder ball.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: January 16, 2018
    Assignee: ams AG
    Inventors: Cathal Cassidy, Martin Schrems, Franz Schrank