Patents by Inventor Martin Sobczak

Martin Sobczak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive compositions and methods of using them
    Patent number: 10059827
    Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: August 28, 2018
    Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
  • Conductive Compositions and Methods of Using Them
    Publication number: 20160251495
    Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
    Type: Application
    Filed: May 6, 2016
    Publication date: September 1, 2016
    Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
  • Conductive compositions and methods of using them
    Patent number: 9355938
    Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: May 31, 2016
    Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
  • CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
    Publication number: 20140153167
    Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
    Type: Application
    Filed: October 21, 2013
    Publication date: June 5, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
  • Mono-acid hybrid conductive composition and method
    Patent number: 8564140
    Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: October 22, 2013
    Assignee: Alpha Metals, Inc.
    Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
  • CONDUCTIVE COMPOSITIONS AND METHODS OF USING THEM
    Publication number: 20100084757
    Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.
    Type: Application
    Filed: September 25, 2009
    Publication date: April 8, 2010
    Inventors: Rajan Hariharan, James Hurley, Senthil Kanagavel, Jose Quinones, Martin Sobczak, Deborah Makita
  • Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
    Patent number: 6750301
    Abstract: Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: June 15, 2004
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Mark R. Bonneau, Yun K. Shin, Gina Hoang, Martin Sobczak