Abstract: An adhesive composition, which comprises either an A- or B-side epoxy, and further includes a plurality of microspheres blended into either the A-side epoxy alone, the B-side epoxy alone, or into both. The microspheres of the invention are preferably made of a thermoplastic shell. As a result of the use of this adhesive between two substrates, a thin, strong bond may be formed between those two substrates. The bond is formed by a combination of an epoxy and a plurality of the microspheres. This epoxy and microsphere combination substantially inhibits seepage of the epoxy through the holes in a first, porous substrate.