Abstract: A dry cabinet for storing surface mount devices in a low humidity environment containing an integrated dry gas forming means in the form of a desiccator or a nitrogen generator which can receive a source of compressed air and form a dry air stream or a concentrated dry nitrogen stream which can be directed into the interior space of the cabinet to maintain the environment within the cabinet a low relative humidity. The cabinet with it self contained dry gas forming source is more economical than prior art dry cabinets which require a centralized nitrogen source.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: A dry cabinet for storing surface mount devices in a low humidity environment containing an integrated dry gas forming means in the form of a desiccator or a nitrogen generator which can receive a source of compressed air and form a dry air stream or a concentrated dry nitrogen stream which can be directed into the interior space of the cabinet to maintain the environment within the cabinet a low relative humidity. The cabinet with it self contained dry gas forming source is more economical than prior art dry cabinets which require a centralized nitrogen source.

Abstract: A coolant system for cooling a fiber includes a heat exchanger with an internal passage disposed between a fiber inlet and fiber outlet to cool the fiber moving through the internal passage. A plurality of chambers are disposed within the internal passage, and at least one fluid medium flows within at least a portion of the internal passage, and at least one adjustable seal is positioned within the internal passage to form a partition between two adjacent chambers. A gas analyzer communicates with at least one chamber of the internal passage to extract a fluid sample from the chamber and to measure a concentration of a gas in the extracted fluid sample. A controller communicates with the analyzer and controls at least one of the adjustable seal and the flow rate of fluid medium within the internal passage based upon the measured concentration.

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract: Methods and apparatus are presented which allow efficient environmental testing of components such as printed circuit boards, integrated circuits, sub-systems and other components. In one method of the invention, a component can be placed into a chamber having an internal space filled with a gaseous atmosphere. The component is indirectly cooled by smartly positioning one or more cooling coils near the component to be tested, and the cooling coils are fed with a cryogenic fluid from a source of cryogenic fluid. The warm cryogenic fluid is recycled by one of two means: a thermosiphon conduit loop, and a storage and compression facility for reusing the warm cryogenic fluid. The internal space is preferably filled with a dry gas.

Abstract: The apparatus and method of the present invention relates use of a warm and dry atmosphere in electronic component storage areas. The warm and dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues by removing moisture from the components. In accordance with one aspect of the present invention, a component storage system includes an enclosed component storage area and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components, and a temperature control system for controlling a temperature of the dry gas to about 10° C. to about 60° C.

Abstract: Methods and apparatus are presented which allow efficient environmental testing of components such as printed circuit boards, integrated circuits, sub-systems and other components. In one method of the invention, a component can be placed into a chamber having an internal space filled with a gaseous atmosphere. The component is indirectly cooled by smartly positioning one or more cooling coils near the component to be tested, and the cooling coils are fed with a cryogenic fluid from a source of cryogenic fluid. The warm cryogenic fluid is recycled by one of two means: a thermosiphon conduit loop, and a storage and compression facility for reusing the warm cryogenic fluid. The internal space is preferably filled with a dry gas.

Abstract: The invention relates to a method and apparatus to use nitrogen, or any other inert gas, or a reducing gas as a process gas to reflow and planarize solder paste in a single heating step. The inert gas may also be used to cool the solder paste after reflowing. According to one method soldered paste is printed onto the printed circuit board with conventional methods employing a mask or stencil. A mesh, die, or mold element having a plurality of openings therein is lowered onto the soldered paste and the printed circuit board is reflowed and planarized in a single heating step. Once the paste is applied, the parts are reflowed and planarized in a single, brief, thermal excursion. The heated mesh is lowered into the solder paste causing the paste to wick through the mesh forming a meniscus. A hot gas knife is arranged to plane the meniscus of the solder paste off of the mesh. An inert, nitrogen, or reducing gas is diffused through the knife to prevent oxidation.