Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

Abstract: In a base element of a waveguide for a detector system at least a portion of radiation passing via the front side and incident on the diffractive element in a selection region is deflected via the diffractive element such that the deflected portion is propagated as coupled-in radiation in the base element by reflection to the out-coupling region and is incident on the associated out-coupling section of the out-coupling region. The out-coupling region couples at least a portion of the radiation out of the base element such that it is incident on the associated sensor section of the sensor unit, which continuously measures the intensity of the incident radiation and supplies the control unit. The control unit determines the distance of the object from the front side of the base element according to the measured intensity.

Abstract: In a base element of a waveguide for a detector system at least one portion of radiation passing via the front side and impinging on a diffractive element in the display region is deflected via the diffractive element according to the selection region. The deflected portion is propagated as coupled-in radiation via reflection to an out-coupling region and impinges on the associated out-coupling section of the out-coupling region. The portion of radiation coupled out by an out-coupling section impinges on an associated sensor section of the sensor unit, which continuously measures the intensity of the impinging radiation and supplies the control unit, wherein, according to a change of intensity, which is dependent on positioning an object in front of the front side of the base element and in front of a selection region of the display region, the control unit determines whether the one selection region has been selected.

Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

Abstract: To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N+(R3)(R4)—(CH2)a—N(H)—C(Y)—N(H)—(CH2)b—N+(R3)(R4)—R5}n 2n X?, with R1, R2, R3, R4, R5, Y and X? being defined as claimed.

Abstract: The present invention relates to an aqueous composition and a process for etching of copper and copper alloys. The aqueous composition comprises Fe3+ ions, an acid and a N-alkoxylated polyamide. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.

Abstract: Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ?100 ?m.

Abstract: Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ?100 ?m.

Abstract: In order to be able to produce high density circuits on a dielectric substrate wherein the conductor lines of said circuit have a good adhesion to the dielectric substrate surface, a method is provided which comprises the following method steps: a) providing an auxiliary substrate having two sides, at least one of said sides having an electrically conductive surface; b) treating at least one of the at least one electrically conductive surface with at least one release layer forming compound, the at least one release layer forming compound being a heterocyclic compound having at least one thiol group, c) forming a patterned resist coating on at least one of said at least one electrically conductive surface which has been treated with said at least one release layer forming compound, the patterned resist coating having at least one resist opening thereby exposing the electrically conductive surface; d) forming an electrically conductive pattern in the at least one resist opening by electrodepositing a metal on

Abstract: To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N+(R3)(R4)—(CH2)a—N(H)—C(Y)—N(H)—(CH2)b—N+(R3)(R4)—R5}n2n X?, with R1, R2, R3, R4, R5, Y and X? being defined as claimed.