Abstract: A method for manufacturing a sensor for a motor vehicle. The method includes placing a sensor core in a lower indentation of a mold; the sensor core having a metal lead frame, including connection pins and lateral retention members, and an integrated circuit, including at least one measurement cell and being overmolded on a support zone of the metal lead frame so the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the overmolded integrated circuit; placing two lateral indentations of the mold on either side of the magnet and the integrated circuit so the lateral indentations retain the lead frame in the vicinity of the lateral retention members; overmolding the integrated circuit, the magnet and part of the lead frame to allow the free end of the terminals to project; and removing the mold.

Abstract: A method for manufacturing a sensor for a motor vehicle. The method includes placing a sensor core in a lower indentation of a mold; the sensor core having a metal lead frame, including connection pins and lateral retention members, and an integrated circuit, including at least one measurement cell and being overmolded on a support zone of the metal lead frame so the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the overmolded integrated circuit; placing two lateral indentations of the mold on either side of the magnet and the integrated circuit so the lateral indentations retain the lead frame in the vicinity of the lateral retention members; overmolding the integrated circuit, the magnet and part of the lead frame to allow the free end of the terminals to project; and removing the mold.

Abstract: A method for manufacturing a sensor for an automotive vehicle, the sensor includes an integrated circuit and a magnetic element. The method includes the steps of arranging the integrated circuit in a housing of a support zone of a leadframe formed in a metal base plate; the leadframe including branches constituting electrical tracks, electrically connecting the integrated circuit to the branches, placing the magnetic element against the support zone in line with the integrated circuit and at a predetermined fixed distance from the integrated circuit so as to form a space between the magnetic element and the integrated circuit, overmolding the assembly formed by the support zone, the integrated circuit and the magnetic element with a polyepoxide material so as to obtain an internal overmolding, overmolding the internal overmolding with a thermoplastic material so as to obtain the sensor.

Abstract: A method for producing, on a metal retainer plate, an electronic module undergoing an electrical test. Prior to a final overmolding that forms the exterior envelope of the electronic module, there is performed a limited initial overmolding of at least one electrical-connection zone, thus surrounding a free-end portion of a rough form of an insulating second securing bar, by establishing between these a non-conducting overmolded bridge, a first securing bar is cut off from a component or element in order to electrically isolate said at least one electrical-connection zone, and an electrical test is performed on the zone prior to the final overmolding of the exterior envelope, with the electronic component or element being secured to the insulating second securing bar and to the retainer plate by the overmolded bridge.

Abstract: The invention relates to a method for producing a connecting element, wherein electrical connections are defined by selective stamping-out. The invention further relates to a connecting element produced in this way and to a sensor arrangement having a connecting element of this kind.

Abstract: A method for producing, on a metal retainer plate, an electronic module undergoing an electrical test. Prior to a final overmolding that forms the exterior envelope of the electronic module, there is performed a limited initial overmolding of at least one electrical-connection zone, thus surrounding a free-end portion of a rough form of an insulating second securing bar, by establishing between these a non-conducting overmolded bridge, a first securing bar is cut off from a component or element in order to electrically isolate said at least one electrical-connection zone, and an electrical test is performed on the zone prior to the final overmolding of the exterior envelope, with the electronic component or element being secured to the insulating second securing bar and to the retainer plate by the overmolded bridge.

Abstract: A method for manufacturing a measurement sensor for a motor vehicle is disclosed. The vehicle has a body and an electronic measurement module mounted in the body. The method includes molding the body of the sensor so as to define, in one and the same material, a base for fastening the sensor, an element for receiving the electronic measurement module, and a seal. The element delineates a space for receiving the electronic measurement module and includes a first cylindrical portion with a circular cross section and a second cylindrical portion with a circular cross section. The diameter of the second cylindrical portion is smaller than the diameter of the first cylindrical portion. The method further includes mounting the electronic measurement module in the reception space, and overmolding the element for receiving the electronic measurement module.

Abstract: The invention relates to a method for producing a connecting element, wherein electrical connections are defined by selective stamping-out. The invention further relates to a connecting element produced in this way and to a sensor arrangement having a connecting element of this kind.

Abstract: A measuring sensor for a motor vehicle, including a body and an electronic measurement module having an integrated circuit for measurement management and a plurality of connection pins that are able to be linked to an electrical communication network of a motor vehicle. The sensor includes an electrical component carrier to which an electrical component is fastened, the component having a first connection wire, connected electrically to a first portion of a first connection pin of the plurality of connection pins of the electronic measurement module and a second connecting wire, connected electrically to a second portion of a second connection pin of the plurality of connection pins of the electronic measurement module.

Abstract: A method for manufacturing a measurement sensor for a motor vehicle, having a body and an electronic measurement module mounted in the body. The method including molding the body of the sensor so as to define, in one and the same material, a base for fastening the sensor, an element for receiving the electronic measurement module, delineating a space for receiving the electronic measurement module and including a first cylindrical portion with a circular cross section and a second cylindrical portion with a circular cross section, the diameter of the second cylindrical portion being smaller than the diameter of the first cylindrical portion, and a seal made from material of the second portion, mounting the electronic measurement module in the reception space, and overmolding the element for receiving the electronic measurement module.

Abstract: A measuring sensor for a motor vehicle, including a body and an electronic measurement module having an integrated circuit for measurement management and a plurality of connection pins that are able to be linked to an electrical communication network of a motor vehicle. The sensor includes an electrical component carrier to which an electrical component is fastened, the component having a first connection wire, connected electrically to a first portion of a first connection pin of the plurality of connection pins of the electronic measurement module and a second connecting wire, connected electrically to a second portion of a second connection pin of the plurality of connection pins of the electronic measurement module.