Patents by Inventor Martin Tiong We Tay

Martin Tiong We Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTHEAD ASSEMBLY WITH PROFILED EXTERIOR SURFACE
    Publication number: 20110025778
    Abstract: A printhead assembly for an inkjet printer is disclosed. The printhead assembly has an elongate printhead chip with a nozzle face defining an array of nozzles. A support structure supports the elongate printhead chip on an external surface thereof. An epoxy resin is also provided adjacent a long side edge of the elongate printhead chip. The epoxy resin is profiled such that the epoxy resin is flush with the nozzle face of the elongate printhead chip. The epoxy resin is thixotropic prior to setting.
    Type: Application
    Filed: October 14, 2010
    Publication date: February 3, 2011
    Inventors: Vesa Karppinen, John Douglas Peter Morgan, Michael John Hudson, Asanga Gunatilake, Laval Chung-Long-Shan, Martin Tiong We Tay, Akira Nakazawa, Norman Michael Berry, Garry Raymond Jackson
  • Printhead with exterior surface profiled for wiping maintenance station
    Patent number: 7832838
    Abstract: A printhead assembly with an elongate printhead IC having a nozzle face defining an array of nozzles, and a support structure for supporting the elongate printhead IC on an external surface such that its length is transverse to a media feed direction through the printer. The external surface has a section that is flush with a long side edge of the elongate printhead IC.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: November 16, 2010
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Vesa Karppinen, John Douglas Peter Morgan, Michael John Hudson, Asanga Gunatilake, Laval Chung-Long-Shan, Martin Tiong We Tay, Akira Nakazawa, Norman Micheal Berry, Garry Raymond Jackson
  • FABRICATION OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM BY PHOTOPATTERNING
    Publication number: 20090233050
    Abstract: A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing an adhesive polymeric film, the film being comprised of one or more photopatternable materials; (b) exposing predetermined regions of the film through a mask; and (c) developing the film to define a plurality of ink supply holes.
    Type: Application
    Filed: March 17, 2008
    Publication date: September 17, 2009
    Inventors: Seung Jin Lee, Martin Tiong We Tay, Kia Silverbrook
  • PRINTHEAD WITH EXTERIOR SURFACE PROFILED FOR WIPING MAINTENANCE STATION
    Publication number: 20090179963
    Abstract: A printhead assembly with an elongate printhead IC having a nozzle face defining an array of nozzles, and a support structure for supporting the elongate printhead IC on an external surface such that its length is transverse to a media feed direction through the printer. The external surface has a section that is flush with a long side edge of the elongate printhead IC.
    Type: Application
    Filed: January 16, 2008
    Publication date: July 16, 2009
    Inventors: Vesa Karppinen, John Douglas Peter Morgan, Michael John Hudson, Asanga Gunatilake, Laval Chung-Long-Shan, Martin Tiong We Tay, Akira Nakazawa, Norman Micheal Berry, Garry Raymond Jackson