Patents by Inventor Martin Traving

Martin Traving has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a layer arrangement and layer arrangement
    Patent number: 7807563
    Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: October 5, 2010
    Assignee: Infineon Technologies AG
    Inventors: Zvonimir Gabric, Werner Pamler, Guenther Schindler, Gernot Steinlesberger, Andreas Stich, Martin Traving, Eugen Unger
  • Method for manufacturing a layer arrangement and layer arrangement
    Publication number: 20070246831
    Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.
    Type: Application
    Filed: April 12, 2007
    Publication date: October 25, 2007
    Inventors: Zvonimir Gabric, Werner Pamler, Guenther Schindler, Gernot Steinlesberger, Andreas Stich, Martin Traving, Eugen Unger