Patents by Inventor Martin Wang

Martin Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9361327
    Abstract: A data structure comprising two or more sub data structures representing a given data set is maintained. Each of the two or more sub data structures comprises an array of bit positions and has a set of hash functions associated therewith. Each of the hash functions is operable to map an element of the given data set to at least one of the bit positions of the array. One of the two or more sub data structures is recognized as a master sub data structure and the others of the two or more sub data structures as slave sub data structures. Insertion and deletion of elements in the data structure is based on the recognition of each of the two or more sub data structures as the master sub data structure or one of the slave sub data structures.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: June 7, 2016
    Assignee: EMC Corporation
    Inventors: Peter Chen, Jr., Qin Xin, Qi Bao, Feng Zhang, Martin Wang
  • Patent number: 9169962
    Abstract: Systems and methods related to computer peripheral devices and mounts are described including device mounts with three linkages. A first linkage may include a body, an abutment piece approximately perpendicular to the body, and a device attachment mechanism disposed proximate to said abutment piece. A second linkage is rotatably connected to the first linkage and a third linkage is rotatably connected to the second linkage. The third linkage may at least partially overlaps the second linkage and extend beyond an end of the second linkage. A camera housing may also be attached to the first linkage, e.g. by a hinge or socket joint. The second linkage may be connected to the first linkage via a friction hinge, and the third linkage may be connected to the second linkage via another friction hinge. The third linkage may preferably include a substantially planar contact surface with a chamfered leading edge.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: October 27, 2015
    Assignee: Logitech Europe S.A.
    Inventors: Stone Wang, Jump Lin, Martin Wang, Kenneth Ling
  • Publication number: 20130048817
    Abstract: Systems and methods related to computer peripheral devices and mounts are described including device mounts with three linkages. A first linkage may include a body, an abutment piece approximately perpendicular to the body, and a device attachment mechanism disposed proximate to said abutment piece. A second linkage is rotatably connected to the first linkage and a third linkage is rotatably connected to the second linkage. The third linkage may at least partially overlaps the second linkage and extend beyond an end of the second linkage. A camera housing may also be attached to the first linkage, e.g. by a hinge or socket joint. The second linkage may be connected to the first linkage via a friction hinge, and the third linkage may be connected to the second linkage via another friction hinge. The third linkage may preferably include a substantially planar contact surface with a chamfered leading edge.
    Type: Application
    Filed: August 24, 2011
    Publication date: February 28, 2013
    Applicant: Logitech Europe S.A.
    Inventors: Stone Wang, Jump Lin, Martin Wang, Kenneth Ling
  • Publication number: 20120011804
    Abstract: Poles for supporting electric transmission lines and a method for forming such poles are provided. An exemplary pole includes a center shaft and a first modular support shaft. The first modular support shaft surrounds more or less of the length of the center shaft and includes a plurality of first panels.
    Type: Application
    Filed: April 4, 2011
    Publication date: January 19, 2012
    Inventors: Michael Winterhalter, Martin Wang
  • Patent number: 6588163
    Abstract: A type of relief engraved doorplate, comprising an inside plate that is composed of a first Bakelite layer and a second Bakelite layer, said first Bakelite layer and second Bakelite layer being composed of coarse wood dust and fine wood powder respectively, the second Bakelite layer enveloping the exterior of the first Bakelite layer before they are subjected to heated compression molding to obtain the relief engraved pattern on the top and bottom panels of the inside plate; and, at least one pair of outside decorative plates, including at least a layer of thin wood plate and a layer of water-resistant paper, the water-resistant paper being glued onto the thin wood plate and put in a compression mold with a pattern that is opposite to that of the inside plate, to obtain a depressed pattern on one side of the outside decorative plate, which is opposite to the relief engraved pattern on the inside plate, and then it is fitted to the top and bottom panels of the inside plate and subjected to compression molding
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: July 8, 2003
    Inventors: Martin Wang, Chi-Sui Wang, Jui-Shih Lin, Tzu Chin Lin
  • Publication number: 20030014932
    Abstract: A type of relief engraved doorplate, comprising an inside plate that is composed of a first Bakelite layer and a second Bakelite layer, said first Bakelite layer and second Bakelite layer being composed of coarse wood dust and fine wood powder respectively, the second Bakelite layer enveloping the exterior of the first Bakelite layer before they are subjected to heated compression molding to obtain the relief engraved pattern on the top and bottom panels of the inside plate; and, at least one pair of outside decorative plates, including at least a layer of thin wood plate and a layer of water-resistant paper, the water-resistant paper being glued onto the thin wood plate and put in a compression mold with a pattern that is opposite to that of the inside plate, to obtain a depressed pattern on one side of the outside decorative plate, which is opposite to the relief engraved pattern on the inside plate, and then it is fitted to the top and bottom panels of the inside plate and subjected to compression molding
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Inventors: Martin Wang, Chi-Sui Wang, Jui-Shih Lin, Tzu Chin Lin
  • Patent number: D552144
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: October 2, 2007
    Assignee: Logitech Europe S.A.
    Inventors: Andy Logan, Mark Martinez, Martin Wang, Carol Wu, Kenneth Ling
  • Patent number: D552649
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: October 9, 2007
    Assignee: Logitech Europe S.A.
    Inventors: Andy Logan, Mark Martinez, Martin Wang, Carol Wu, Kenneth Ling
  • Patent number: D554682
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: November 6, 2007
    Assignee: Logitech Europe S.A.
    Inventors: Mark Martinez, Martin Wang, Ivan Liu, Glen Kuo, Brian Stephens
  • Patent number: D557124
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: December 11, 2007
    Assignee: Logitech Europe S.A.
    Inventors: Mark Martinez, Martin Wang, Ivan Liu, Glen Kuo, Brian Stephens
  • Patent number: D579967
    Type: Grant
    Filed: March 31, 2007
    Date of Patent: November 4, 2008
    Assignee: Logitech Europe S.A.
    Inventors: Chris Jones, John Lapetina, Mark Martinez, Andrew Heymann, Ivan Ho, Martin Wang
  • Patent number: D682332
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: May 14, 2013
    Assignee: Logitech Europe S.A.
    Inventors: Stone Wang, Jump Lin, Martin Wang, Kenneth Ling