Patents by Inventor Martin Weggen

Martin Weggen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
    Publication number: 20060160275
    Abstract: The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a position for defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater distance from each other than in the encapsulating position, and feed means for encapsulating material connecting onto the mould cavity. The invention also relates to a method for encapsulating with encapsulating material an electronic component fixed on a carrier.
    Type: Application
    Filed: January 6, 2004
    Publication date: July 20, 2006
    Applicant: FICO B.V.
    Inventors: Martin Weggen, Michel Hendrikus Teunissen, Wilhelmus Gal