Abstract: A spring biased contact pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a lower plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the lower plunger member and the upper end of the internal cavity. A high electrical resistance spacer member is positioned in the internal cavity in contact with the lower plunger member and the spring member. Spring force exerted through the spacer member urges the lower plunger member into electrical contact with the barrel wall. A method of transmitting electricity through an electrical contact assembly includes urging a plunger member against the wall of a barrel member in which it is reciprocally mounted with a high electrical resistance member.

Abstract: A spring biased contact pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a lower plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the lower plunger member and the upper end of the internal cavity. A high electrical resistance spacer member is positioned in the internal cavity in contact with the lower plunger member and the spring member. Spring force exerted through the spacer member urges the lower plunger member into electrical contact with the barrel wall. A method of transmitting electricity through an electrical contact assembly includes urging a plunger member against the wall of a barrel member in which it is reciprocally mounted with a high electrical resistance member.

Abstract: An integrated circuit supports auto-sense of voltage for drive strength adjustment. The method may comprise detecting an input voltage received at an auto-sense pad integrated on a mobile multimedia processing (MMP) chip. The input voltage may be a power supply voltage of the peripheral device received during power-up of the MMP chip, power-up of the peripheral circuitry, and/or dynamically while the MMP is powered-up. The auto-sense pad may adjust drive strength of at least one other pad, which may be an output pad or a bidirectional pad, integrated on the MMP chip may be configured to operate using the determined output voltage. A rise time and/or fall time of signals output by the MMP chip may be varied by the adjustment of the drive strength.

Abstract: An integrated circuit supports auto-sense of voltage for drive strength adjustment. The method may comprise detecting an input voltage received at an auto-sense pad integrated on a mobile multimedia processing (MMP) chip. The input voltage may be a power supply voltage of the peripheral device received during power-up of the MMP chip, power-up of the peripheral circuitry, and/or dynamically while the MMP is powered-up. The auto-sense pad may adjust drive strength of at least one other pad, which may be an output pad or a bidirectional pad, integrated on the MMP chip may be configured to operate using the determined output voltage. A rise time and/or fall time of signals output by the MMP chip may be varied by the adjustment of the drive strength.

Abstract: Certain embodiments of the invention may be found in a method for integrated circuit supporting auto-sense of voltage for drive strength adjustment. The method may comprise detecting an input voltage received at an auto-sense pad integrated on a mobile multimedia processing (MMP) chip. The input voltage may be a power supply voltage of the peripheral device received during power-up of the MMP chip, power-up of the peripheral circuitry, and/or dynamically while the MMP is powered-up. The auto-sense pad may adjust drive strength of at least one other pad, which may be an output pad or a bidirectional pad, integrated on the MMP chip may be configured to operate using the determined output voltage. A rise time and/or fall time of signals output by the MMP chip may be varied by the adjustment of the drive strength.

Abstract: Certain embodiments of the invention may be found in a method for integrated circuit supporting auto-sense of voltage for drive strength adjustment. The method may comprise detecting an input voltage received at an auto-sense pad integrated on a mobile multimedia processing (MMP) chip. The input voltage may be a power supply voltage of the peripheral device received during power-up of the MMP chip, power-up of the peripheral circuitry, and/or dynamically while the MMP is powered-up. The auto-sense pad may adjust drive strength of at least one other pad, which may be an output pad or a bidirectional pad, integrated on the MMP chip may be configured to operate using the determined output voltage. A rise time and/or fall time of signals output by the MMP chip may be varied by the adjustment of the drive strength.