Patents by Inventor Martin Wielpütz

Martin Wielpütz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100055425
    Abstract: A film which comprises a layer composed of a moulding composition composed of a semicrystalline polyamide whose enthalpy of fusion is at least 8 J/g is used for production of a composite part with a substrate composed of a moulding composition composed of a substantially amorphous polyamide whose enthalpy of fusion is less than 8 J/g.
    Type: Application
    Filed: August 24, 2007
    Publication date: March 4, 2010
    Applicant: EVONIK DEGUSSA GMBH
    Inventors: Kirsten Luetzeler, Klaus Huelsmann, Martin Wielpuetz, Roland Wursche
  • Publication number: 20100003524
    Abstract: A composite part is composed of I. a multilayer film, which comprises the following layers: a) a layer composed of a polyamide moulding composition and b) following in the inwards direction, a layer composed of an adhesion promoter, which comprises from 5 to 100% by weight of a copolymer, which contains the following monomer units: from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, ?-olefins and vinylaromatics, and from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxide group and an oxazoline group, and II. a substrate composed of a polycarbonate moulding composition.
    Type: Application
    Filed: August 22, 2007
    Publication date: January 7, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Kirsten Luetzeler, Martin Wielpuetz, Frank Lorenz, Klaus Huelsmann, Roland Wursche
  • Publication number: 20100003534
    Abstract: A composite part is composed of I. a multilayer film, which comprises the following layers: a) a layer composed of a polyamide moulding composition and b) following in the inwards direction, a layer composed of an adhesion promoter, which comprises from 5 to 100% by weight of a copolymer, which contains the following monomer units: from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, ?-olefins and vinylaromatics, and from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxide group and an oxazoline group, and II. a substrate composed of a polyalkyl (meth)acrylate moulding composition.
    Type: Application
    Filed: August 22, 2007
    Publication date: January 7, 2010
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Kirsten Luetzeler, Klaus Huelsmann, Martin Wielpuetz, Frank Lorenz, Roland Wursche
  • Publication number: 20090286096
    Abstract: A film comprising the following layers: I. a layer based on a polyamide whose monomer units contain an average of at least 8 carbon atoms, II. an immediately adjacent layer composed of a moulding composition comprising a polyamide as in I. and a copolymer having functional groups is used for the production of a composite with a substrate which comprises PA6, PA66, PA6/66 or PPA, giving secure adhesion.
    Type: Application
    Filed: January 15, 2008
    Publication date: November 19, 2009
    Applicant: EVONIK DEGUSSA GmbH
    Inventors: Kirsten Alting, Roland Wursche, Harald Haeger, Martin Wielpuetz