Patents by Inventor Martin Wielpuetz
Martin Wielpuetz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12091783Abstract: Stretched filaments based on aromatic polyethers, wherein the filaments have been stretched at a temperature between glass transition temperature and melting point and wherein the filaments are cooled down to below the glass transition temperature under full tensile load and a process for production thereof and use thereof.Type: GrantFiled: October 17, 2019Date of Patent: September 17, 2024Assignee: Evonik Operations GmbHInventors: Lan de Gans Li, Martin Wielpütz, Markus Hartmann, Dirk Heinrich Bücker
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Patent number: 11807025Abstract: A plastic material is useful as an ink receiver or printing medium in dye diffusion thermal transfer printing, wherein the plastic material has a polyamide component (a), and a (co)-polyamide (b) based on ether units and amide units. This plastic material can be used to make a layered structure. The layered structure can be used in dye diffusion thermal transfer printing. A security and/or valuable document with the layered structure can be obtained. Based on the finding that the (co)-polyamide (h) offers sufficient absorbency for the printing ink, the layer produced from the plastic material can be printed on by means of dye diffusion thermal transfer printing with a good color intensity.Type: GrantFiled: May 25, 2018Date of Patent: November 7, 2023Assignees: Evonik Operations GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.Inventors: Huifeng Yu, Jianmin Yang, Fei Teng, Chenyu Ye, Florian Hermes, Martin Wielpütz
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Publication number: 20220064821Abstract: The present invention is directed to stretched filaments based on fluoropolymers, where the filaments were stretched at a temperature between 70° C. and the Vicat temperature and where the filaments are cooled under full tensile load to room temperature.Type: ApplicationFiled: December 17, 2019Publication date: March 3, 2022Applicant: Evonik Operations GmbHInventors: Lan DE GANS LI, Martin WIELPUETZ, Markus HARTMANN, Dirk Heinrich BUECKER
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Publication number: 20210381135Abstract: Stretched filaments based on linear, branched or cyclic, aliphatic or semiaromatic polyamides, wherein the filaments have been stretched at a temperature between glass transition temperature and melting point and wherein the filaments are cooled down to room temperature under full tensile load.Type: ApplicationFiled: October 9, 2019Publication date: December 9, 2021Applicant: Evonik Operations GmbHInventors: Lan de Gans Li, Martin Wielpütz, Markus Hartmann, Dirk Heinrich Bücker
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Publication number: 20210332507Abstract: Stretched filaments based on aromatic polyethers, wherein the filaments have been stretched at a temperature between glass transition temperature and melting point and wherein the filaments are cooled down to below the glass transition temperature under full tensile load and a process for production thereof and use thereof.Type: ApplicationFiled: October 17, 2019Publication date: October 28, 2021Applicant: Evonik Operations GmbHInventors: Lan de Gans Li, Martin Wielpütz, Markus Hartmann, Dirk Heinrich Bücker
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Publication number: 20210206187Abstract: A plastic material is useful as an ink receiver or printing medium in dye diffusion thermal transfer printing, wherein the plastic material has a polyamide component (a), and a (co)-polyamide (b) based on ether units and amide units. This plastic material can be used to make a layered structure. The layered structure can be used in dye diffusion thermal transfer printing. A security and/or valuable document with the layered structure can be obtained. Based on the finding that the (co)-polyamide (b) offers sufficient absorbency for the printing ink, the layer produced from the plastic material can be printed on by means of dye diffusion thermal transfer printing with a good color intensity.Type: ApplicationFiled: May 25, 2018Publication date: July 8, 2021Applicants: Evonik Operations GmbH, Evonik Specialty Chemicals (Shanghai) Co., Ltd.Inventors: Huifeng Yu, Jianmin Yang, Fei Teng, Chenyu Ye, Florian Hermes, Martin Wielpütz
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Patent number: 10661541Abstract: A multilayered laminate film containing dispersed pigment which is suitable as a back cover for a solar module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises: at least 35% by weight, of polyamide; and from 1 to 65% by weight of a light-reflecting filler; b) optionally, a layer of a thermoplastic moulding composition; and c) a layer of a moulding composition which comprises at least 35% by weight, of polyamide; and from 1 to 65% by weight of a light-reflecting filler; wherein at least one of layers a) and c) further comprises from 1 to 25% by weight of the layer composition of a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof. A solar module containing the multilayered laminate film is also provided.Type: GrantFiled: October 11, 2012Date of Patent: May 26, 2020Assignee: Evonik Operations GmbHInventors: Andreas Pawlik, Martin Wielpuetz, Michael Beyer
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Patent number: 10479059Abstract: A film comprising the following layers: I. a layer based on a polyamide whose monomer units contain an average of at least 8 carbon atoms, II. an immediately adjacent layer composed of a moulding composition comprising a polyamide as in I. and a copolymer having functional groups is used for the production of a composite with a substrate which comprises PA6, PA66, PA6/66 or PPA, giving secure adhesion.Type: GrantFiled: January 15, 2008Date of Patent: November 19, 2019Assignee: Evonik Degussa GmbHInventors: Kirsten Alting, Roland Wursche, Harald Haeger, Martin Wielpuetz
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Patent number: 10350865Abstract: A multilayer film containing layers of polyamide and polyester, suitable as a back cover for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer which comprises at least 35% by weight of polyamide; c) a layer which comprises at least 35% by weight, of a thermoplastic polyester; and e) a layer which comprises at least 35% by weight of polyamide; wherein the layers a) and e) further comprise 0.1 to 60% by weight, of a polyamine-polyamide graft copolymer, or the layer c) further comprises 0.1 to 30% by weight of polyamine-polyamide graft copolymer. The polyamine-polyamide graft copolymer comprises as copolymerized monomers: a polyamine having at least 4 nitrogen atoms and at least one polyamide-forming unit selected from the group consisting of a lactam, an ?-aminocarboxylic acid and an equimolar combinations of a diamine and a dicarboxylic acid. In another embodiment, adhesion promoting layers are placed between the layers.Type: GrantFiled: October 11, 2012Date of Patent: July 16, 2019Assignee: Evonik Degussa GmbHInventors: Andreas Pawlik, Martin Wielpuetz, Harald Haeger
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Patent number: 9248627Abstract: Multilayer films of polyamide and polypropylene which have good layer adhesion and are suitable for a back cover of a solar module are provided. In a first embodiment, the multilayer film contains in the order listed: a) a layer containing at least 35% by weight, of polyamide; c) a layer containing at least 35% by weight of a polypropylene; and e) a layer containing at least 35% by weight, of polyamide; wherein the layer c) further comprises a polypropylene having acid anhydride groups or a polypropylene compatible functionalized polyolefin having functional groups to adhere the layer c) to each of layers a) and e). In a second embodiment adhesion promoter layers are present between the respective polyamide and polypropylene layers.Type: GrantFiled: October 11, 2012Date of Patent: February 2, 2016Assignee: EVONIK DEGUSSA GmbHInventors: Andreas Pawlik, Martin Wielpuetz, Harald Haeger
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Publication number: 20140037937Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.Type: ApplicationFiled: October 10, 2013Publication date: February 6, 2014Applicant: EVONIK DEGUSSA GmbHInventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
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Patent number: 8614005Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.Type: GrantFiled: December 21, 2011Date of Patent: December 24, 2013Assignee: Evonik Degussa GmbHInventors: Roland Wursche, Sonja Bollmann, Harald Haeger, Martin Wielpuetz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
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Publication number: 20130092233Abstract: A multilayer film containing layers of polyamide and polyester, suitable as a back cover for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer which comprises at least 35% by weight of polyamide; c) a layer which comprises at least 35% by weight, of a thermoplastic polyester; and e) a layer which comprises at least 35% by weightof polyamide; wherein the layers a) and e) further comprise 0.1 to 60% by weight, of a polyamine-polyamide graft copolymer, or the layer c) further comprises 0.1 to 30% by weight of polyamine-polyamide graft copolymer. The polyamine-polyamide graft copolymer comprises as copolymerized monomers: a polyamine having at least 4 nitrogen atoms and at least one polyamide-forming unit selected from the group consisting of a lactam, an ?-aminocarboxylic acid and an equimolar combinations of a diamine and a dicarboxylic acid. In another embodiment, adhesion promoting layers are placed between the layers.Type: ApplicationFiled: October 11, 2012Publication date: April 18, 2013Inventors: Andreas PAWLIK, Martin Wielpuetz, Harald Haeger
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Publication number: 20130092228Abstract: A multilayered film and a photovoltaic module where the oxidation-sensitive solar cell is protected against ingress of oxygen provided. The solar cell is protected by the multilayer film as a back cover. The multilayer film comprises the following layers in direct succession: a solar cell-facing layer of a moulding composition comprising at least 70% by weight of EVOH, an adhesion promoter layer, a middle layer of a thermoplastic moulding composition, an optional adhesion promoter layer, and an outer layer comprising at least 35% by weight of polyamide.Type: ApplicationFiled: October 11, 2012Publication date: April 18, 2013Inventors: Andreas PAWLIK, Martin WIELPUETZ, Harald HAEGER
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Publication number: 20130092226Abstract: A multilayer film suitable as a backing for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises at least 35% by weight, based on the overall layer moulding composition, of polyamide; b) a layer of a moulding composition which comprises at least 50% by weight, based on the overall layer moulding composition, of a polymer fraction consisting of: I) 30 to 95 parts by weight of polyamide and II) 5 to 70 parts by weight of polyolefin, where a sum of I) and II) in parts by weight is 100; and c) a layer of a moulding composition which comprises at least 35% by weight, based on the overall moulding composition, of polyamide; wherein at least one of layers a), b) and c) further comprises a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof.Type: ApplicationFiled: October 11, 2012Publication date: April 18, 2013Inventors: Andreas Pawlik, Martin Wielpuetz, Michael Beyer
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Publication number: 20130092232Abstract: Multilayer films of polyamide and polypropylene which have good layer adhesion and are suitable for a back cover of a solar module are provided. In a first embodiment, the multilayer film contains in the order listed: a) a layer containing at least 35% by weight, of polyamide; c) a layer containing at least 35% by weight of a polypropylene; and e) a layer containing at least 35% by weight, of polyamide; wherein the layer c) further comprises a polypropylene having acid anhydride groups or a polypropylene compatible functionalized polyolefin having functional groups to adhere the layer c) to each of layers a) and e). In a second embodiment adhesion promoter layers are present between the respective polyamide and polypropylene layers.Type: ApplicationFiled: October 11, 2012Publication date: April 18, 2013Inventors: Andreas PAWLIK, Martin WIELPUETZ, Harald HAEGER
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Publication number: 20130092227Abstract: A multilayered laminate film containing dispersed pigment which is suitable as a back cover for a solar module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises: at least 35% by weight, of polyamide; and from 1 to 65% by weight of a light-reflecting filler; b) optionally, a layer of a thermoplastic moulding composition; and c) a layer of a moulding composition which comprises at least 35% by weight, of polyamide; and from 1 to 65% by weight of a light-reflecting filler; wherein at least one of layers a) and c) further comprises from 1 to 25% by weight of the layer composition of a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof. A solar module containing the multilayered laminate film is also provided.Type: ApplicationFiled: October 11, 2012Publication date: April 18, 2013Inventors: Andreas PAWLIK, Martin WIELPUETZ, Michael BEYER
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Publication number: 20120094116Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.Type: ApplicationFiled: December 21, 2011Publication date: April 19, 2012Applicant: EVONIK DEGUSSA GmbHInventors: Roland WURSCHE, Sonja Bollmann, Harald Häger, Martin Wielpütz, Kirsten Alting, Michael Beyer, Franz-Erich Baumann
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Patent number: 8007916Abstract: A composite part is produced by a process in which at least one of components a) and b) of said composite part is treated with an Openair plasma on a contact surface between said components a) and b) prior to production of the composite part, followed by molding-on of the other component; wherein said components are as follows: a) a part which entirely or to some extent comprises a molding composition comprising at least 40% by weight of a polyamide whose monomer units contain an average of at least 8 carbon atoms, and b) a part comprising another molding composition.Type: GrantFiled: January 30, 2006Date of Patent: August 30, 2011Assignee: Evonik Degussa GmbHInventors: Karl Kuhmann, Klaus Hülsmann, Martin Wielpütz, Walter-Konrad Mertens, Ursula Schaub, Kirsten Alting, Simon Amesöder, Leo Hoffmann
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Publication number: 20110045269Abstract: A component which comprises the following components: I. a top layer of a moulding compound which contains at least 50% by weight of PA613 and II. a substrate of a thermoplastic moulding compound has a surface with high scratch resistance and high chemical resistance.Type: ApplicationFiled: June 23, 2009Publication date: February 24, 2011Applicant: EVONIK DEGUSSA GmbHInventors: Roland Wursche, Sonja Bollmann, Franz-Erich Baumann, Beatrice Kueting, Kirsten Luetzeler, Andreas Pawlik, Martin Wielpuetz