Patents by Inventor Martin Wilfried HELLER

Martin Wilfried HELLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240053377
    Abstract: An acceleration sensor includes a first substrate and a second substrate, wherein the first substrate includes: a first anchor region provided on a partial region of a bottom surface of a first substrate cavity; a first anchor protruding from the first anchor region toward the second substrate along a first direction; a spring extending from the first anchor in a second direction perpendicular to the first direction; and a movable electrode mechanically connected to and electrically insulated from the spring, and configured to be displaced in the first direction, and wherein the second substrate includes: a second anchor region provided on a partial region of a bottom surface of a second substrate cavity; a second anchor protruding from the second anchor region toward the first substrate along the first direction; and a fixed electrode mechanically fixed to the second anchor and facing the movable electrode.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 15, 2024
    Applicant: ROHM CO., LTD.
    Inventor: Martin Wilfried HELLER
  • Publication number: 20240017989
    Abstract: A MEMS device includes a substrate which has a first main surface and a second main surface facing the first main surface, and in which a silicon substrate, a silicon carbide layer having conductivity, and a silicon layer are sequentially stacked from a second main surface side toward a first main surface side, a cavity recessed over the silicon layer, the silicon carbide layer, and the silicon substrate from the first main surface of the substrate to the second main surface side of the substrate, a MEMS electrode which is arranged in the cavity, is composed of the silicon layer and the silicon carbide layer, and is spaced apart from a bottom surface of the cavity to the first main surface side, and an isolation joint which divides the MEMS electrode in a plan view and mechanically connects and electrically isolates both sides of the divided MEMS electrode.
    Type: Application
    Filed: July 7, 2023
    Publication date: January 18, 2024
    Applicant: ROHM CO., LTD.
    Inventor: Martin Wilfried HELLER
  • Publication number: 20230417613
    Abstract: A pressure sensor includes: a substrate having first and second main surfaces and having a thickness in first direction; a first chamber recessed from the first main surface in the first direction with respect to the substrate; a second chamber recessed from the first main surface in the first direction with respect to the substrate and adjacent to the first chamber in second direction; a fluid passage recessed from the first main surface in the first direction with respect to the substrate and causing the first chamber to be in fluid communication with an outside; a closing layer laminated on the first main surface of the substrate and closing openings of the first chamber and the second chamber; and a membrane partitioned by the first and second chambers in the second direction and extending in a plane parallel to the first direction and a third direction.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 28, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Martin Wilfried HELLER, Toma FUJITA
  • Publication number: 20230382717
    Abstract: A MEMS sensor includes a semiconductor chip that has a first principal surface and a second principal surface and that has a cavity, a frame portion that forms a bottom portion and a side portion of the cavity, and a movable portion that is formed on the side of the first principal surface and that is supported by the frame portion in a floating state with respect to the cavity, and, in the MEMS sensor, the frame portion has a stepped surface formed at a height position between the bottom portion of the cavity and the first principal surface, and the movable portion includes a main body portion facing the cavity in a first direction and an extension portion that extends from the main body portion toward an upper region of the stepped surface in a second direction and that faces the stepped surface in the first direction.
    Type: Application
    Filed: August 11, 2023
    Publication date: November 30, 2023
    Applicant: ROHM CO., LTD.
    Inventor: Martin Wilfried HELLER
  • Publication number: 20230324243
    Abstract: A pressure sensor includes: a substrate; a cavity provided in the substrate; a cap provided on the substrate and configured to seal the cavity; and a pressure conduit passing through the substrate and held in a hollow inside the cavity, wherein the pressure conduit includes a tubular insulating layer and a piezoelectric material layer, which is provided on an inner surface of the insulating layer and has a hollow portion therein, wherein the pressure conduit has one end closed in an inside of the cavity and the other end opened toward an outside of the substrate, and wherein the pressure sensor detects deformation of the pressure conduit due to a pressure difference between the outside of the substrate and the inside of the cavity as a change in voltage of the piezoelectric material layer.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 12, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Martin Wilfried HELLER, Nobuhisa YAMASHITA
  • Publication number: 20230257258
    Abstract: A semiconductor device includes a sensor structure body, a gas conduit that extends from a surface of the sensor structure body toward a hollow space in the sensor structure body to introduce a gas into the hollow space from outside, a pressure sensor that is formed inside the sensor structure body and has a membrane which is able to vibrate by actions of the gas, an acceleration sensor that is formed inside the sensor structure body to detect an acceleration that has acted on the sensor structure body, and a sealing resin that covers the sensor structure body, in which the gas conduit includes an inner end portion on the hollow space side and an outer end portion on the end surface side of the sensor structure body, and the outer end portion of the gas conduit is opened on an end surface of the sealing resin.
    Type: Application
    Filed: February 6, 2023
    Publication date: August 17, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Martin Wilfried HELLER, Toma FUJITA
  • Publication number: 20230166967
    Abstract: A MEMS sensor includes: a first substrate having a cavity partially exposed on the surface of the first substrate; an electrode of a sensor element provided on the first substrate and arranged in the cavity; a support portion provided on the first substrate and configured to support the electrode; an element isolation portion formed on the first substrate so as to cover the support portion and configured to electrically isolate the electrode and the support portion from each other; an epitaxial growth layer formed on the electrode and the element isolation portion of the first substrate; and a second substrate bonded to the first substrate and configured to cover the sensor element, wherein the epitaxial growth layer has a monocrystalline portion arranged on the electrode and a polycrystalline portion arranged on the element isolation portion.
    Type: Application
    Filed: November 22, 2022
    Publication date: June 1, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Daisuke KAMINISHI, Martin Wilfried HELLER, Toma FUJITA
  • Publication number: 20230166964
    Abstract: A MEMS sensor includes: a conductive device-side substrate including cavity in thickness direction thereof; a MEMS electrode arranged in the cavity; a support extending in first direction toward the MEMS electrode from peripheral wall of the cavity and connected to and support the MEMS electrode; and an isolator traversing the support in second direction in plan view to isolate the support into a first support on the side of the MEMS electrode and a second support on the side of the device-side substrate to be electrically insulated from each other in the first direction, wherein the isolator includes: a trench recessed in the thickness direction with respect to the device-side substrate; insulating layers formed on inner wall surfaces of the trench; and joining layers formed on the insulating layers and including portions facing each other and at least partially joined to each other in the first direction.
    Type: Application
    Filed: November 17, 2022
    Publication date: June 1, 2023
    Applicant: ROHM CO., LTD.
    Inventors: Nobuhisa YAMASHITA, Toma FUJITA, Martin Wilfried HELLER