Abstract: Described is a vehicle door actuating apparatus (100). The vehicle door actuating apparatus (100) includes an actuating surface (106), a sensor (140), such as an inductive sensor or switch, and a mechanism for transmitting a compressive force applied by a user to the actuating surface (106) into a movement that is detectable by the sensor. The mechanism includes a first component (111) or a first component group on which the switch (140) is at least partially fixed and a transmission element (120) that is pivotally arranged on the first component (111) or the first component group. The transmission element (120) is pivotable between a home position in which the sensor (140) is not triggered by the transmission element (120) and an actuating position in which the sensor (140) is triggered by the transmission element (120). The transmission element (120) is movable relative to the actuating apparatus (102).

Abstract: A photosensitive element includes a semiconductor substrate, a light sensitive region formed in the semiconductor substrate, an inactive region at least partly surrounding the light sensitive region, and a protective layer having an opening leaving the light sensitive region uncovered by the protective layer. The protective layer is an anti-reflective coating having in at least a part of a spectral range between 300 nm and 1200 nm a reflectivity of less than 10% and a transmittance of less than 0.1%.

Abstract: An arrangement for an optoelectronic component includes a substrate and an optical semiconductor chip arranged on the substrate. The optical semiconductor chip has an optically active region, a first optically non-active region, and a second optically non-active region. A connection structure connects a chip-side electrical connection to the optically active region. An electrical connection connects the chip-side electrical connection to a second substrate-side electrical connection. A coating is provided in a layer stack in the optically active region, in the first optically non-active region, and in the second optically non-active region. The layer stack includes a first layer and a second layer arranged above the first layer. The chip-side electrical connection and the connection structure in the first optically non-active region and the protective layer in the second optically non-active region are each arranged between the first layer and the second layer.

Abstract: An arrangement for an optoelectronic component includes a substrate and an optical semiconductor chip arranged on the substrate. The optical semiconductor chip has an optically active region, a first optically non-active region, and a second optically non-active region. A connection structure connects a chip-side electrical connection to the optically active region. An electrical connection connects the chip-side electrical connection to a second substrate-side electrical connection. A coating is provided in a layer stack in the optically active region, in the first optically non-active region, and in the second optically non-active region. The layer stack includes a first layer and a second layer arranged above the first layer. The chip-side electrical connection and the connection structure in the first optically non-active region and the protective layer in the second optically non-active region are each arranged between the first layer and the second layer.

Abstract: A fireproof molding body having a hot side and a cold side opposite said hot side, wherein the fireproof molding body includes a first material with ceramic hollow sphere structures, wherein an amount of hollow sphere structures decreases from the hot side to the cold side. A method for producing a fireproof molding body in which a first material with ceramic hollow sphere structures is introduced into a casting mold and a grading of the hollow sphere structures is subsequently performed.

Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.

Abstract: A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.

Abstract: A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.

Abstract: A silo combustion chamber for a gas turbine having a flame tube having an inner wall and flame tube base delimiting a combustion chamber; an outer wall surrounding the inner wall, forming a cavity; an annular chamber at least partly surrounding the outer wall and a number of supply lines fluidically coupled to the hot side of a heat exchanger during operation of the turbine; a number of burners, each of which opens into the combustion chamber on the outlet side through an opening in the flame tube base. The oxygen supply is fluidically connected to the annular chamber. A collecting chamber is arranged over the flame tube base. The annular chamber is connected to the collecting chamber via each connecting piece, each burner is fluidically connected to the collecting chamber to supply oxygen. The cavity between the inner and outer wall is locally fluidically separated from the collecting chamber.

Abstract: A gas turbine has a compressor, a central housing, at least one combustion chamber, an expansion turbine, and a heat exchanger. Each combustion chamber is fluidically connected to the expansion turbine via an inner housing which is guided through the interior of the central housing. The compressor is fluidically separated from the interior of the central housing by an annular collection chamber connected to an outlet of the compressor and which has a number of discharge lines which are connected to the cold side of the heat exchanger during operation. Each combustion chamber is designed as a silo combustion chamber, and each silo combustion chamber has an inner wall, which delimits a combustion chamber, and an outer wall, and the outer wall surrounds the inner wall, thereby forming a cavity. The inner wall transitions into the inner housing, and the cavity transitions into the interior of the central housing.

Abstract: The application describes a method for manufacturing metal structures for the electrical connection of components. The method comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.

Abstract: A gas turbine has a compressor, a central housing, at least one combustion chamber, an expansion turbine, and a heat exchanger. Each combustion chamber is fluidically connected to the expansion turbine via an inner housing which is guided through the interior of the central housing. The compressor is fluidically separated from the interior of the central housing by an annular collection chamber connected to an outlet of the compressor and which has a number of discharge lines which are connected to the cold side of the heat exchanger during operation. Each combustion chamber is designed as a silo combustion chamber, and each silo combustion chamber has an inner wall, which delimits a combustion chamber, and an outer wall, and the outer wall surrounds the inner wall, thereby forming a cavity. The inner wall transitions into the inner housing, and the cavity transitions into the interior of the central housing.

Abstract: A silo combustion chamber for a gas turbine having a flame tube having an inner wall and flame tube base delimiting a combustion chamber; an outer wall surrounding the inner wall, forming a cavity; an annular chamber at least partly surrounding the outer wall and a number of supply lines fluidically coupled to the hot side of a heat exchanger during operation of the turbine; a number of burners, each of which opens into the combustion chamber on the outlet side through an opening in the flame tube base. The oxygen supply is fluidically connected to the annular chamber. A collecting chamber is arranged over the flame tube base. The annular chamber is connected to the collecting chamber via each connecting piece, each burner is fluidically connected to the collecting chamber to supply oxygen. The cavity between the inner and outer wall is locally fluidically separated from the collecting chamber.

Abstract: A process and apparatus for liquefying a gas stream comprising hydrocarbons and sour species is provided in which the sour species are removed in liquefied form as the sweetened gas stream is progressively cooled to liquefaction temperatures. The process involves cooling the gas stream in a manner to produce a cooled gas stream comprising gaseous hydrocarbons and residual sour species. The cooled gas stream is then treated with a cold solvent to deplete the cooled gas stream of residual sour species. The resulting cooled sweetened gas stream is then further cooled to produce liquid hydrocarbons.

Abstract: A method for operating a gas turbine below its rated power, in which CO emissions in the exhaust gas of the gas turbine increase with a reduction of the output gas turbine power, wherein, if a predefined threshold value, which can be selected as desired, for the CO emissions is reached or if a predefined threshold value, specified in relative or absolute terms, for the output gas turbine power is undershot, the combustion temperature in the combustion chamber of the gas turbine is increased. To operate the gas turbine with low emissions, for a constant power output, the exhaust-gas temperature increase generated at the outlet of the gas turbine as a result of the combustion temperature increase is at least partially compensated through the addition of a liquid or vaporous medium.

Abstract: A process and apparatus for liquefying a gas stream comprising hydrocarbons and sour species is provided in which the sour species are removed in liquefied form as the sweetened gas stream is progressively cooled to liquefaction temperatures. The process involves cooling the gas stream in a manner to produce a cooled gas stream comprising gaseous hydrocarbons and residual sour species. The cooled gas stream is then treated with a cold solvent to deplete the cooled gas stream of residual sour species. The resulting cooled sweetened gas stream is then further cooled to produce liquid hydrocarbons.