Abstract: Provided according to embodiments of the invention are electrical stress grading compositions that include a polymer, inorganic nanoplatelets, and inorganic filler particles, wherein the inorganic nanoplatelets and the inorganic filler particles are dispersed in the polymer. Also provided are electrical devices that include such electrical stress grading compositions including, for example, power cable accessories, insulators, bushings, and surge arrestors. Further provided according to embodiments of the invention are methods of forming electrical stress grading compositions.

Abstract: A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a different metal than the metal of the intermediate plating layer. The layered plating stack with the strike layer maintains contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams after 1 or more days of exposure to a gaseous environment which includes Cl2, NO2 and SO2. The layered plating stack with the strike layer also maintains a contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams with a wipe of at least approximately 0.1 mm after exposure to a gaseous environment which includes one or more of H2S, Cl2, NO2 and SO2.

Abstract: A mezzanine power pin includes a dual layer pin body extending between a pin top having an upper power interface and a pin bottom having a lower power interface. The dual layer pin body has a base metal core and an outer metal oxide layer combined with the base metal core defining an outermost layer of the dual layer pin body. The mezzanine power pin includes an upper fastener coupled to the pin top to mechanically and electrically connect an upper component to the upper power interface. The mezzanine power pin includes a lower fastener coupled to the pin bottom to mechanically and electrically connect a lower component to the lower power interface. The base metal core is configured to electrically connect the upper component and the lower component through the base metal core.

Abstract: A mezzanine power pin includes a dual layer pin body extending between a pin top having an upper power interface and a pin bottom having a lower power interface. The dual layer pin body has a base metal core and an outer metal oxide layer combined with the base metal core defining an outermost layer of the dual layer pin body. The mezzanine power pin includes an upper fastener coupled to the pin top to mechanically and electrically connect an upper component to the upper power interface. The mezzanine power pin includes a lower fastener coupled to the pin bottom to mechanically and electrically connect a lower component to the lower power interface. The base metal core is configured to electrically connect the upper component and the lower component through the base metal core.

Abstract: In some embodiments, a method of producing a metallic article includes providing a metallic powder, selecting a predetermined concentration for a reactive component, providing a controlled atmosphere including the reactive component at the predetermined concentration, and additively manufacturing the metallic article from the metallic powder under the controlled atmosphere. The metallic powder includes a metallic element or metallic alloy. The reactive component reacts with the metallic powder in a weld pool formed during the additive manufacturing to form a dispersion of nano-particles in the weld pool. The nano-particles are dispersed throughout the metallic article in a substantially uniform manner. In some embodiments, the metallic powder includes the reactive component. Metallic articles formed by the disclosed methods are also disclosed.

Abstract: A method for inhibiting corrosion in metal components such as electrical contacts, comprising providing a component, wherein the component includes a first metal layer; a second metal layer deposited on the first metal layer; at least one additional metal layer deposited on the second metal layer; and an electrically active contact region on the uppermost layer of the at least one additional metal layer; and forming a defect in the component in at least one predetermined location around the electrically active contact region, wherein the defect passes through the at least one additional metal layer to expose the second metal layer, through the at least one additional metal layer and second metal layer to expose the first metal layer, or a combination thereof.