Abstract: A sensor has a thin film element, the thin film element having a temperature-dependent electrical resistance. The thin film element includes a platinum layer, which is doped with zircon or zircon oxide. The thin film element can be arranged on a membrane to create a mass airflow sensor.

Abstract: A method for manufacturing micro-mechanical components in which a structure is produced on a silicon layer, which is to be undercut in a further step. The silicon is selectively anodized for this undercutting operation. Thus, the method enables the manufacturing of micro-mechanical components that can be integrated together with bipolar circuit elements.

Abstract: An acceleration sensor and a method of making an acceleration sensor is described in which a movable sensor element is located in a hollow space formed in the middle of three silicon plates. During production, air can be removed from the hollow space through a hole in one of the two outer plates. The hole is then closed by an additional plate, which allows for a defined pressure to be set in the hollow space.

Abstract: A method for producing capacitive sensors which is used in particular for the parallel production of capacitive sensors with exactly defined stray capacitance. For this purpose, troughs (15, 16, 17) are cut along or parallel to the splitting lines (6), so that adjustment errors in the position of the cut, during separation of the sensors, and variations in the cut width have no effect on the stray capacitance.

Abstract: A device for one-sided etching of a semiconductor wafer (silicon wafer) is proposed, which consists in the manner of an etching box of a trough-shaped basic body (3, 23) and a lid (2, 22) which matches the latter hermetically. The lid (2, 22) has on the topside an opening (5, 25) for the passage of the etching liquid. The etching box bears at least two O-rings (7, 8, 27, 28), of which one is arranged centrally in the basic body (3, 23) and the other centrally in the lid (2, 22). The wafer (1) is clamped between the O-rings (7, 8, 27, 28). A wire (10) connected to the wafer by means of a plate of a spring contact (11, 41) is guided out of the etching box through a bore (4) extending through the basic body (3, 23).

Abstract: A method of making acceleration sensors with integrated measurement of internal pressure includes connecting multiple plates to each other, thereby defining internal cavities. The tightness of these connections or bonds is checked and controlled during the manufacturing process. The plates define membrane portions adjacent each cavity, the membranes deforming in accordance with the internal pressure in the adjacent cavity. Preferably, the internal pressure of the sensor is measurable by detecting deformation of a sensor wall which defines a membrane.

Abstract: A method is proposed for assembling micromechanical sensors, in particular Hall sensors, or pressure or acceleration sensors, in which at least one silicon sensor element is applied to a substrate. The at least one silicon sensor element is joined to the substrate via at least one assembly pedestal, the cap faces of which are kept small compared with the surface of the silicon sensor element, so that a gap exists between the substrate and the silicon sensor element except for the region of the at least one assembly pedestal.

Abstract: A microwave is made of a stack of layers. A sculptured silicon substrate is held between two covers each consisting of one or more layers. The inlet and the outlet of the microvalve are formed by perforations in the respective covers. A central valve plate is sculptured out of the silicon substrate with surfaces respectively facing the two covers in the region of the inlet and outlet in a symmetrical fashion. The valve plate is connected to the outer frame portion of the silicon substrate by one or more silicon strips. The valve plate is also shaped as a closure member near the inlet and/or the outlet. Electrodes are provided on the covers opposite the valve plate so that the valve can be electrostatically actuated with the valve plate serving as counterelectrode for these electrodes on the covers.